Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6841859 | Premolded cavity IC package | Neil McLellan, Hugo Chi Wai Wong, William Lap Keung Chow | 2005-01-11 |
| 6821817 | Premolded cavity IC package | Neil McLellan, Hugo Chi Wai Wong, William Lap Keung Chow | 2004-11-23 |