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Method of manufacturing an enhanced thermal dissipation integrated circuit package |
Robert Sheppard, Tai Wai Pun, Hau Ng, Chun Ho Fan, Neil Robert McLellen |
2006-03-21 |
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Method of manufacturing an integrated circuit package |
Neil McLellan, Chun Ho Fan, Tsang Cheung, Chow Keung, Sadak Thamby Labeeb |
2004-09-14 |
| 6734552 |
Enhanced thermal dissipation integrated circuit package |
Robert Sheppard, Tai Wai Pun, Hau Wan Ng, Chun Ho Fan, Neil Robert McLellen |
2004-05-11 |
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Molded plastic package with heat sink and enhanced electrical performance |
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2004-04-20 |
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Molded plastic package with heat sink and enhanced electrical performance |
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2003-04-22 |
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Molded plastic package with heat sink and enhanced electrical performance |
Marcos Karnezos, S. C. Chang, John R. Fahey |
2001-12-04 |
| 6284569 |
Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener |
Robert Sheppard |
2001-09-04 |
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Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly |
Robert Sheppard |
2001-09-04 |
| 6111324 |
Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package |
Robert Sheppard |
2000-08-29 |
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High power dissipation plastic encapsulated package for integrated circuit die |
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1997-01-21 |