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USPTO Patent Rankings Data through Dec 31, 2025
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Edward Combs — 10 Patents

A-A-Sat: 10 patents #7 of 49Top 15%
Foster City, CA: #399 of 2,058 inventorsTop 20%
California: #61,378 of 386,348 inventorsTop 20%
Overall (All Time): #481,000 of 4,157,543Top 15%
10 Patents All Time
Edward Combs has been granted 10 US patents while listed as an inventor at A-Sat. The first was granted in 1997 and the most recent in March 2006. Edward Combs ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Edward Combs in Foster City, CA, US.

Patents per Year

Patents granted per year, 1997 to 2006Bar chart with a peak of 3 patents in 2001.peak 31997: 1 patents19972000: 1 patents20002001: 3 patents20012003: 1 patents20032004: 3 patents20042006: 1 patents2006

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
7015072 Method of manufacturing an enhanced thermal dissipation integrated circuit package Robert Sheppard, Tai Wai Pun, Hau Ng, Chun Ho Fan, Neil Robert McLellen 2006-03-21
6790710 Method of manufacturing an integrated circuit package Neil McLellan, Chun Ho Fan, Tsang Cheung, Chow Keung, Sadak Thamby Labeeb 2004-09-14
6734552 Enhanced thermal dissipation integrated circuit package Robert Sheppard, Tai Wai Pun, Hau Wan Ng, Chun Ho Fan, Neil Robert McLellen 2004-05-11
6724071 Molded plastic package with heat sink and enhanced electrical performance 2004-04-20
6552417 Molded plastic package with heat sink and enhanced electrical performance 2003-04-22
6326678 Molded plastic package with heat sink and enhanced electrical performance Marcos Karnezos, S. C. Chang, John R. Fahey 2001-12-04
6284569 Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener Robert Sheppard 2001-09-04
6285075 Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly Robert Sheppard 2001-09-04
6111324 Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package Robert Sheppard 2000-08-29
5596231 High power dissipation plastic encapsulated package for integrated circuit die 1997-01-21