Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7015072 | Method of manufacturing an enhanced thermal dissipation integrated circuit package | Robert Sheppard, Tai Wai Pun, Hau Ng, Chun Ho Fan, Neil Robert McLellen | 2006-03-21 |
| 6790710 | Method of manufacturing an integrated circuit package | Neil McLellan, Chun Ho Fan, Tsang Cheung, Chow Keung, Sadak Thamby Labeeb | 2004-09-14 |
| 6734552 | Enhanced thermal dissipation integrated circuit package | Robert Sheppard, Tai Wai Pun, Hau Wan Ng, Chun Ho Fan, Neil Robert McLellen | 2004-05-11 |
| 6724071 | Molded plastic package with heat sink and enhanced electrical performance | — | 2004-04-20 |
| 6552417 | Molded plastic package with heat sink and enhanced electrical performance | — | 2003-04-22 |
| 6326678 | Molded plastic package with heat sink and enhanced electrical performance | Marcos Karnezos, S. C. Chang, John R. Fahey | 2001-12-04 |
| 6284569 | Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener | Robert Sheppard | 2001-09-04 |
| 6285075 | Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly | Robert Sheppard | 2001-09-04 |
| 6111324 | Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package | Robert Sheppard | 2000-08-29 |
| 5596231 | High power dissipation plastic encapsulated package for integrated circuit die | — | 1997-01-21 |