Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7015072 | Method of manufacturing an enhanced thermal dissipation integrated circuit package | Edward Combs, Tai Wai Pun, Hau Ng, Chun Ho Fan, Neil Robert McLellen | 2006-03-21 |
| 6734552 | Enhanced thermal dissipation integrated circuit package | Edward Combs, Tai Wai Pun, Hau Wan Ng, Chun Ho Fan, Neil Robert McLellen | 2004-05-11 |
| 6284569 | Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener | Edward Combs | 2001-09-04 |
| 6285075 | Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly | Edward Combs | 2001-09-04 |
| 6111324 | Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package | Edward Combs | 2000-08-29 |