Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7015072 | Method of manufacturing an enhanced thermal dissipation integrated circuit package | Edward Combs, Robert Sheppard, Tai Wai Pun, Hau Ng, Chun Ho Fan | 2006-03-21 |
| 6734552 | Enhanced thermal dissipation integrated circuit package | Edward Combs, Robert Sheppard, Tai Wai Pun, Hau Wan Ng, Chun Ho Fan | 2004-05-11 |