Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8299632 | Routing layer for mitigating stress in a semiconductor die | Gabriel Wong | 2012-10-30 |
| 8294266 | Conductor bump method and apparatus | Neil McLellan, Yip Seng Low, Andrew KW Leung | 2012-10-23 |
| 8227926 | Routing layer for mitigating stress in a semiconductor die | Gabriel Wong | 2012-07-24 |
| 8120170 | Integrated package circuit with stiffener | Neil McLellan, Vincent Chan | 2012-02-21 |
| 8058108 | Methods of forming semiconductor chip underfill anchors | Neil McLellan | 2011-11-15 |
| 7994044 | Semiconductor chip with contoured solder structure opening | Neil McLellan | 2011-08-09 |
| 7985621 | Method and apparatus for making semiconductor packages | Vincent Chan, Neil McLellan | 2011-07-26 |
| 7973408 | Semiconductor chip passivation structures and methods of making the same | — | 2011-07-05 |
| 7906424 | Conductor bump method and apparatus | Neil McLellan, Yip Seng Low, Andrew KW Leung | 2011-03-15 |
| 7888259 | Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same | Adam Zbrzezny | 2011-02-15 |
| 7790501 | Semiconductor chip passivation structures and methods of making the same | — | 2010-09-07 |
| 7670939 | Semiconductor chip bump connection apparatus and method | Vincent Chan, Fan Yeung | 2010-03-02 |