Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157824 | Integrated circuit (IC) package and package substrate comprising stacked vias | Houssam Jomaa, Layal Rouhana, Seongryul Choi | 2018-12-18 |
| 9679841 | Substrate and method of forming the same | Houssam Jomaa, Omar J. Bchir, Chin-Kwan Kim | 2017-06-13 |
| 9370097 | Package substrate with testing pads on fine pitch traces | Chin-Kwan Kim, Omar J. Bchir | 2016-06-14 |