Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10541198 | Semiconductor package device and method of manufacturing the same | Chien Lin CHANG CHIEN, Chin-Li KAO, Chang-Chi Lee | 2020-01-21 |
| 10535521 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chen-Chao Wang | 2020-01-14 |
| 10522508 | Semiconductor device package and a method of manufacturing the same | Ian HU, Ming-Han Wang, Tsun-Lung Hsieh, Chih-Yi Huang | 2019-12-31 |
| 10515806 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chen-Chao Wang | 2019-12-24 |
| 10276382 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chen-Chao Wang | 2019-04-30 |
| 10236208 | Semiconductor package structure and method of manufacturing the same | Chin-Cheng Kuo, Pao-Nan Lee, Ying-Te Ou | 2019-03-19 |
| 10217649 | Semiconductor device package having an underfill barrier | Jin-Yuan Lai, Tang-Yuan Chen, Ying-Xu Lu, Dao-Long Chen, Kwang-Lung Lin +3 more | 2019-02-26 |
| 10181448 | Semiconductor devices and semiconductor packages | Dao-Long Chen, Ying-Ta Chiu, Ping-Feng Yang | 2019-01-15 |
| 10014250 | Semiconductor devices | Sheng-Chi Hsieh | 2018-07-03 |
| 9917071 | Semiconductor packages | Ying-Ta Chiu, Yong-Da Chiu, Dao-Long Chen, Chih-Cheng Lee | 2018-03-13 |
| 9917043 | Semiconductor package device and method of manufacturing the same | Chien Lin CHANG CHIEN, Chin-Li KAO, Chang-Chi Lee | 2018-03-13 |
| 8653633 | Semiconductor device packages with electromagnetic interference shielding | Kuo-Hsien Liao, Chi-Tsung Chiu | 2014-02-18 |
| 8350367 | Semiconductor device packages with electromagnetic interference shielding | Chi-Tsung Chiu, Jui-Cheng Huang | 2013-01-08 |
| 8212339 | Semiconductor device packages with electromagnetic interference shielding | Kuo-Hsien Liao, Jian-Cheng Chen, Chen-Chuan Fan, Chi-Tsung Chiu | 2012-07-03 |
| 8022511 | Semiconductor device packages with electromagnetic interference shielding | Chi-Tsung Chiu, Jui-Cheng Huang | 2011-09-20 |
| 8000107 | Carrier with embedded component and method for fabricating the same | Yung-Hui Wang, In-De Ou | 2011-08-16 |
| 7989928 | Semiconductor device packages with electromagnetic interference shielding | Kuo-Hsien Liao, Chi-Tsung Chiu | 2011-08-02 |
| 7944707 | Package structure for connection with output/input module | Ying-Te Ou | 2011-05-17 |
| 7586184 | Electronic package | Chi-Tsung Chiu, In-De Ou, Yung-Hui Wang | 2009-09-08 |
| 7576436 | Structure of wafer level package with area bump | — | 2009-08-18 |
| 7312102 | Bridge connection type of chip package and fabricating method thereof | — | 2007-12-25 |
| 7256480 | Lead frame package structure with high density of lead pins arrangement | In-De Ou | 2007-08-14 |
| 7248134 | Inductor and capacitor formed of build-up vias | Sung-Mao Wu, Chi-Tsung Chiu | 2007-07-24 |
| 7060595 | Circuit substrate and fabrication method thereof | In-De Ou, Chia-Shang Chen, Kuang-Hua Lin, Shin-Hua Chao | 2006-06-13 |
| 6974334 | Semiconductor package with connector | — | 2005-12-13 |