Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164756 | Semiconductor device package having continously formed tapered protrusions | Tang-Yuan Chen, Jin-Yuan Lai, Tse-Chuan Chou, Meng-Kai SHIH, Shin-Luh TARNG | 2021-11-02 |
| 10586716 | Semiconductor device package | Tang-Yuan Chen, Jin-Yuan Lai, Tse-Chuan Chou, Meng-Kai SHIH, Shin-Luh TARNG | 2020-03-10 |
| 10217649 | Semiconductor device package having an underfill barrier | Jin-Yuan Lai, Tang-Yuan Chen, Dao-Long Chen, Kwang-Lung Lin, Chih-Pin Hung +3 more | 2019-02-26 |