Issued Patents All Time
Showing 51–57 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927480 | Multi-chip package with electrical interconnection | Bau-Nan Lee, Cheng-Fen Chen, Chih-Wei Tsai | 2005-08-09 |
| 6864588 | MCM package with bridge connection | — | 2005-03-08 |
| 6844617 | Packaging mold with electrostatic discharge protection | Juang-Sheng Chiang | 2005-01-18 |
| 6833610 | Bridge connection type of chip package and fabricating method thereof | — | 2004-12-21 |
| 6828664 | Packaging substrate with electrostatic discharge protection | Yung-Chi Lee | 2004-12-07 |
| 6825568 | Flip chip package structure and flip chip device with area bump | — | 2004-11-30 |
| 6430059 | Integrated circuit package substrate integrating with decoupling capacitor | Jung-Sheng Chiang | 2002-08-06 |