Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer-level semiconductor device packages with electromagnetic interference shielding

Wafer-level semiconductor device packages with electromagnetic interference shielding

US Patent 8378466 · Granted Feb 19, 2013

Estimated economic value: $1,460,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and device for wireless communication2025
Method and device for wireless communication2025
Cockpit display system2025
Multi-screen cockpit display system2025
Method of displaying rear-view image and digital dashboard using the same2025
Semiconductor package structure having a lead frame and a passive component2024
Semiconductor device package2024
Method of displaying rear-view image and mobile device using the same2024
Optical device package and method for manufacturing the same2023
Liquid cooling module and its liquid cooling head2023
Semiconductor device package2023
Liquid-cooling radiator module2023