Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784152 | Semiconductor device package and method for manufacturing the same | Ming Hsien Chu | 2023-10-10 |
| 11404333 | Semiconductor device and method for manufacturing the same | Yuan-Ting Lin, Che-Wei Chang | 2022-08-02 |
| 11175715 | Method of supplying electric power to a computer system | — | 2021-11-16 |
| 11101237 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Ming Hsien Chu | 2021-08-24 |
| 11037898 | Semiconductor device package and method for manufacturing the same | Ming Hsien Chu | 2021-06-15 |
| 10763234 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Ming Hsien Chu | 2020-09-01 |
| 9773753 | Semiconductor devices and methods of manufacturing the same | Yuan-Ting Lin, Wei-Hong LAI, Chin-Li KAO | 2017-09-26 |
| 7071544 | Wafer level assembly package | Tai-Yuan Huang | 2006-07-04 |