Issued Patents All Time
Showing 25 most recent of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424513 | Technologies for isolated heat dissipating devices | Prabhakar Subrahmanyam, Tong Wa Chao, Ying-Feng PANG, Yi Xia, Rahima K. Mohammed +8 more | 2025-09-23 |
| 12243808 | Chip scale package (CSP) semiconductor device having thin substrate | Lin Lv, Shuhua Zhou, Long Wang | 2025-03-04 |
| 11784141 | Semiconductor package having thin substrate and method of making the same | Long Wang, Madhur Bobde, Bo-Wei Chen, Shuhua Zhou | 2023-10-10 |
| 11699627 | DMOS FET chip scale package and method of making the same | Yan Xun Xue, Long Wang, Hongyong Xue, Madhur Bobde, Zhiqiang Niu | 2023-07-11 |
| 11495548 | Semiconductor package having thin substrate and method of making the same | Long Wang, Madhur Bobde, Bo-Wei Chen, Shuhua Zhou | 2022-11-08 |
| 11437297 | Moderated deformation of a vapor chamber to match a shape of a heat source | Guoliang Ying, Guangying Zhang, Xinglong Xu, Wei-Cheng Liao, Fangbo ZHU | 2022-09-06 |
| 11201420 | Package protector with integrated guide pin | Wei-Cheng Liao, Guangying Zhang, Liguang DU, Guoliang Ying, Fangbo ZHU +3 more | 2021-12-14 |
| 10991660 | Semiconductor package having high mechanical strength | Long Wang, Zhen Du, Bo Chen, Yueh-Se Ho | 2021-04-27 |
| 10600727 | Molded intelligent power module for motors | Zhiqiang Niu, Bum Seok Suh, Son Tran, Wanki Hong, Guobing Shen +2 more | 2020-03-24 |
| 10504823 | Power semiconductor device with small contact footprint and the preparation method | Hongtao Gao, Ming-Chen Lu, Jianxin Ye, Yan Huo, Hua Pan | 2019-12-10 |
| 10396019 | Molded intelligent power module and method of making the same | Zhiqiang Niu, Bum Seok Suh, Wonjin Cho | 2019-08-27 |
| 10177080 | Molded intelligent power module | Zhiqiang Niu, Bum Seok Suh, Wonjin Cho | 2019-01-08 |
| 10141249 | Molded intelligent power module and method of making the same | Zhiqiang Niu, Bum Seok Suh, Wonjin Cho | 2018-11-27 |
| 10043736 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2018-08-07 |
| 9929076 | Semiconductor package of a flipped MOSFET chip and a multi-based die paddle with top surface groove-divided multiple connecting areas for connection to the flipped MOSFET electrodes | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz | 2018-03-27 |
| 9854686 | Preparation method of a thin power device | Yuping Gong, Yan Xun Xue, Ming-Chen Lu, Ping Huang, Hamza Yilmaz | 2017-12-26 |
| 9786583 | Power semiconductor package device having locking mechanism, and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, De Mei Gong | 2017-10-10 |
| 9768146 | Battery protection package and process of making the same | Zhiqiang Niu, Yan Xun Xue, Man Sheng Hu, Yueh-Se Ho, Hamza Yilmaz | 2017-09-19 |
| 9735094 | Combined packaged power semiconductor device | Yueh-Se Ho, Hamza Yilmaz, Yan Yun Xue | 2017-08-15 |
| 9685430 | Embedded package and method thereof | Zhiqiang Niu, Hua Pan, Ming-Chen Lu, Yueh-Se Ho | 2017-06-20 |
| 9679833 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Ming-Chen Lu, Hongtao Gao | 2017-06-13 |
| 9653383 | Semiconductor device with thick bottom metal and preparation method thereof | Hamza Yilmaz, Yan Xun Xue, Ming-Chen Lu, Yan Huo, Aihua Lu | 2017-05-16 |
| 9653424 | Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method | Xiaotian Zhang, Kai Lu | 2017-05-16 |
| 9646920 | Power semiconductor device with small contact footprint and the preparation method | Hongtao Gao, Ming-Chen Lu, Jianxin Ye, Yan Huo, Hua Pan | 2017-05-09 |
| 9564406 | Battery protection package and process of making the same | Zhiqiang Niu, Yan Xun Xue, Man Sheng Hu, Yueh-Se Ho, Hamza Yilmaz | 2017-02-07 |