Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862727 | Method for fabricating fin structure for fin field effect transistor | Hao Feng, Hung-Jen Huang, Hsin Min Han, Shih-Wei Su, Ming Shu Chiu +3 more | 2024-01-02 |
| 11581438 | Fin structure for fin field effect transistor and method for fabrication the same | Hao Feng, Hung-Jen Huang, Hsin Min Han, Shih-Wei Su, Ming Shu Chiu +3 more | 2023-02-14 |
| 10573762 | Vertical gallium nitride Schottky diode | TingGang Zhu, Anup Bhalla, Yueh-Se Ho | 2020-02-25 |
| 10333006 | Termination structure for gallium nitride Schottky diode including junction barriar diodes | TingGang Zhu, Anup Bhalla, Yueh-Se Ho | 2019-06-25 |
| 10038106 | Termination structure for gallium nitride Schottky diode | TingGang Zhu, Anup Bhalla, Yueh-Se Ho | 2018-07-31 |
| 9854686 | Preparation method of a thin power device | Yuping Gong, Yan Xun Xue, Ming-Chen Lu, Jun Lu, Hamza Yilmaz | 2017-12-26 |
| 9847247 | Method for filling gaps of semiconductor device and semiconductor device formed by the same | Keng-Jen Lin, Yi-Hui Lin, Yu-Ren Wang | 2017-12-19 |
| 9793174 | FinFET device on silicon-on-insulator and method of forming the same | Yu-Ren Wang, Keng-Jen Lin, Shu-Ming Yeh | 2017-10-17 |
| 9728655 | Termination structure for gallium nitride schottky diode | TingGang Zhu, Anup Bhalla, Yueh-Se Ho | 2017-08-08 |
| 9685319 | Method for filling gaps of semiconductor device and semiconductor device formed by the same | Keng-Jen Lin, Yi-Hui Lin, Yu-Ren Wang | 2017-06-20 |
| 9406661 | Protection circuit including vertical gallium nitride schottky diode and PN junction diode | TingGang Zhu, Anup Bhalla, Yueh-Se Ho | 2016-08-02 |
| 9391005 | Method for packaging a power device with bottom source electrode | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Jun Lu, Lei Shi +1 more | 2016-07-12 |
| 9281265 | Packaging structure of a semiconductor device | Yueh-Se Ho, Yan Xun Xue, Jun Lu, Lei Shi, Liang Zhao | 2016-03-08 |
| 9196534 | Method for preparing semiconductor devices applied in flip chip technology | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Lei Shi, Liang Zhao +3 more | 2015-11-24 |
| 9136379 | Bottom source substrateless power MOSFET | Yueh-Se Ho, Yan Xun Xue | 2015-09-15 |
| 9136154 | Substrateless power device packages | Tao Feng, Zhiqiang Niu, Yuping Gong, Ruisheng Wu, Lei Shi +1 more | 2015-09-15 |
| 9006901 | Thin power device and preparation method thereof | Yuping Gong, Yan Xun Xue, Ming-Chen Lu, Jun Lu, Hamza Yilmaz | 2015-04-14 |
| 8994140 | Vertical gallium nitride Schottky diode | TingGang Zhu, Anup Bhalla, Yueh-Se Ho | 2015-03-31 |
| 8987878 | Substrateless power device packages | Tao Feng, Zhiqiang Niu, Yuping Gong, Ruisheng Wu, Lei Shi +1 more | 2015-03-24 |
| 8865523 | Semiconductor package and fabrication method thereof | Yueh-Se Ho, Yan Xun Xue, Jun Lu, Lei Shi, Liang Zhao | 2014-10-21 |
| 8785296 | Packaging method with backside wafer dicing | Yan Xun Xue, Yueh-Se Ho | 2014-07-22 |
| 8778735 | Packaging method of molded wafer level chip scale package (WLCSP) | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Lei Shi +2 more | 2014-07-15 |
| 8772144 | Vertical gallium nitride Schottky diode | TingGang Zhu, Anup Bhalla, Yueh-Se Ho | 2014-07-08 |
| 8642385 | Wafer level package structure and the fabrication method thereof | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Jun Lu, Ming-Chen Lu | 2014-02-04 |
| 8642397 | Semiconductor wafer level package (WLP) and method of manufacture thereof | Yuping Gong, Yan Xun Xue | 2014-02-04 |