Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990547 | Semiconductor device and method for fabricating the same | Chun-Yu Chen, Bo Huang, Jhong-Yi Huang, Yu-Shu Lin | 2024-05-21 |
| 10460925 | Method for processing semiconductor device | Hsu Ting, Kuang-Hsiu Chen, Chun-Wei Yu, Yu-Ren Wang | 2019-10-29 |
| 10366991 | Semiconductor device and manufacturing method thereof | Hsu Ting, Yu-Ying Lin, Yen-Hsing Chen, Chun-Jen Chen, Chun-Wei Yu +1 more | 2019-07-30 |
| 10347640 | Method for forming semiconductor device | Ya-Ying Tsai | 2019-07-09 |
| 10043888 | Method for forming a semiconductor structure | Yi-Hui Lin, Yu-Ren Wang | 2018-08-07 |
| 9847247 | Method for filling gaps of semiconductor device and semiconductor device formed by the same | Ping Huang, Yi-Hui Lin, Yu-Ren Wang | 2017-12-19 |
| 9793174 | FinFET device on silicon-on-insulator and method of forming the same | Ping Huang, Yu-Ren Wang, Shu-Ming Yeh | 2017-10-17 |
| 9685319 | Method for filling gaps of semiconductor device and semiconductor device formed by the same | Ping Huang, Yi-Hui Lin, Yu-Ren Wang | 2017-06-20 |
| 9570578 | Gate and gate forming process | Chien-Liang Lin, Yu-Ren Wang, Neng-Hui Yang | 2017-02-14 |
| 9543408 | Method of forming patterned hard mask layer | Yi-Hui Lin, Chun-Yao Yang, Yu-Ren Wang | 2017-01-10 |
| 9418853 | Method for forming a stacked layer structure | Shao-Wei Wang, Yu-Tung Hsiao, Shu-Ming Yeh | 2016-08-16 |
| 9356125 | Manufacturing method of semiconductor structure | Yu-Tung Hsiao, Yu-Ren Wang | 2016-05-31 |
| 9130014 | Method for fabricating shallow trench isolation structure | Yu-Ren Wang, Chien-Liang Lin, Tsuo-Wen Lu, Wei-Jen Chen, Chih-Chung Chen | 2015-09-08 |
| 9117878 | Method for manufacturing shallow trench isolation | Yu-Ren Wang, Chih-Chung Chen, Tsuo-Wen Lu, Tsai-Yu Wen | 2015-08-25 |
| 8513519 | Use of exfoliated clay nanoplatelets and method for encapsulating cations | King-Fu Lin, Chia-Hsin Lee, Ken-Yen Liu | 2013-08-20 |
| 8293034 | Lead-free brass alloy | Wei Wu, Wen Lin Lo, Hung-Ching Lu | 2012-10-23 |