Issued Patents All Time
Showing 1–25 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222858 | Semiconductor package having enlarged gate pad and method of making the same | Yan Xun Xue, Long Wang, Xiaotian Zhang, Zhiqiang Niu | 2022-01-11 |
| 11101137 | Method of making reverse conducting insulated gate bipolar transistor | Zhiqiang Niu, Long Wang, Lingpeng Guan, Wenjun Li | 2021-08-24 |
| 11069604 | Semiconductor package and method of making the same | Xiaotian Zhang, Yan Xun Xue, Long Wang, Zhiqiang Niu | 2021-07-20 |
| 10991680 | Common source land grid array package | Yan Xun Xue, Long Wang, Madhur Bobde, Xiaobin Wang, Lin Chen | 2021-04-27 |
| 10991660 | Semiconductor package having high mechanical strength | Long Wang, Zhen Du, Bo Chen, Jun Lu | 2021-04-27 |
| 10573762 | Vertical gallium nitride Schottky diode | TingGang Zhu, Anup Bhalla, Ping Huang | 2020-02-25 |
| 10522666 | Methods for fabricating anode shorted field stop insulated gate bipolar transistor | Anup Bhalla, Madhur Bobde, Yongping Ding, Xiaotian Zhang | 2019-12-31 |
| 10333006 | Termination structure for gallium nitride Schottky diode including junction barriar diodes | TingGang Zhu, Anup Bhalla, Ping Huang | 2019-06-25 |
| 10050134 | Methods for fabricating anode shorted field stop insulated gate bipolar transistor | Anup Bhalla, Madhur Bobde, Yongping Ding, Xiaotian Zhang | 2018-08-14 |
| 10038106 | Termination structure for gallium nitride Schottky diode | TingGang Zhu, Anup Bhalla, Ping Huang | 2018-07-31 |
| 9929076 | Semiconductor package of a flipped MOSFET chip and a multi-based die paddle with top surface groove-divided multiple connecting areas for connection to the flipped MOSFET electrodes | Yan Xun Xue, Hamza Yilmaz, Jun Lu | 2018-03-27 |
| 9837386 | Power device and preparation method thereof | Xiaotian Zhang, Shekar Mallikarjunaswamy, Zhiqiang Niu, Cheow Khoon Oh | 2017-12-05 |
| 9786583 | Power semiconductor package device having locking mechanism, and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Jun Lu, De Mei Gong | 2017-10-10 |
| 9768146 | Battery protection package and process of making the same | Zhiqiang Niu, Yan Xun Xue, Man Sheng Hu, Jun Lu, Hamza Yilmaz | 2017-09-19 |
| 9735094 | Combined packaged power semiconductor device | Hamza Yilmaz, Yan Yun Xue, Jun Lu | 2017-08-15 |
| 9728655 | Termination structure for gallium nitride schottky diode | TingGang Zhu, Anup Bhalla, Ping Huang | 2017-08-08 |
| 9685430 | Embedded package and method thereof | Zhiqiang Niu, Hua Pan, Ming-Chen Lu, Jun Lu | 2017-06-20 |
| 9679833 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2017-06-13 |
| 9564406 | Battery protection package and process of making the same | Zhiqiang Niu, Yan Xun Xue, Man Sheng Hu, Jun Lu, Hamza Yilmaz | 2017-02-07 |
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Zhiqiang Niu, Guo Feng Lian | 2016-12-13 |
| 9478646 | Methods for fabricating anode shorted field stop insulated gate bipolar transistor | Anup Bhalla, Madhur Bobde, Yongping Ding, Xiaotian Zhang | 2016-10-25 |
| 9472491 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2016-10-18 |
| 9437530 | Combined packaged power semiconductor device | Hamza Yilmaz, Yan Yun Xue, Jun Lu | 2016-09-06 |
| 9412684 | Top exposed semiconductor chip package | Yan Xun Xue, Hamza Yilmaz, Anup Bhalla, Jun Lu, Kai Liu | 2016-08-09 |
| 9406661 | Protection circuit including vertical gallium nitride schottky diode and PN junction diode | TingGang Zhu, Anup Bhalla, Ping Huang | 2016-08-02 |