Issued Patents All Time
Showing 26–50 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397029 | Power semiconductor package device having locking mechanism, and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Jun Lu, De Mei Gong | 2016-07-19 |
| 9391005 | Method for packaging a power device with bottom source electrode | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Lei Shi, Liang Zhao +1 more | 2016-07-12 |
| 9337132 | Methods and configuration for manufacturing flip chip contact (FCC) power package | Ming Sun, Kai Liu, Xiaotian Zhang, Leeshawn Luo | 2016-05-10 |
| 9305870 | Power semiconductor device and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Jun Lu | 2016-04-05 |
| 9281265 | Packaging structure of a semiconductor device | Yan Xun Xue, Jun Lu, Lei Shi, Liang Zhao, Ping Huang | 2016-03-08 |
| 9269699 | Embedded package and method thereof | Zhiqiang Niu, Hua Pan, Ming-Chen Lu, Jun Lu | 2016-02-23 |
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Zhiqiang Niu, Guo Feng Lian +2 more | 2016-01-26 |
| 9214417 | Combined packaged power semiconductor device | Hamza Yilmaz, Yan Xun Xue, Jun Lu | 2015-12-15 |
| 9214419 | Power semiconductor device and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Jun Lu | 2015-12-15 |
| 9196534 | Method for preparing semiconductor devices applied in flip chip technology | Yan Xun Xue, Ping Huang, Hamza Yilmaz, Lei Shi, Liang Zhao +3 more | 2015-11-24 |
| 9184117 | Stacked dual-chip packaging structure and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Jun Lu | 2015-11-10 |
| 9171788 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2015-10-27 |
| 9165866 | Stacked dual chip package having leveling projections | Hamza Yilmaz, Xiaotian Zhang, Yan Xun Xue, Anup Bhalla, Jun Lu +2 more | 2015-10-20 |
| 9136379 | Bottom source substrateless power MOSFET | Yan Xun Xue, Ping Huang | 2015-09-15 |
| 9136154 | Substrateless power device packages | Tao Feng, Zhiqiang Niu, Yuping Gong, Ruisheng Wu, Ping Huang +1 more | 2015-09-15 |
| 9040356 | Semiconductor including cup-shaped leadframe packaging techniques | Mike F. Chang, King Owyang, Mohammed Kasem, Lixiong Luo, Wei-Bing Chu | 2015-05-26 |
| 8994140 | Vertical gallium nitride Schottky diode | TingGang Zhu, Anup Bhalla, Ping Huang | 2015-03-31 |
| 8987878 | Substrateless power device packages | Tao Feng, Zhiqiang Niu, Yuping Gong, Ruisheng Wu, Ping Huang +1 more | 2015-03-24 |
| 8981464 | Wafer level chip scale package and process of manufacture | Tao Feng, Francois Hebert, Ming Sun | 2015-03-17 |
| 8952509 | Stacked multi-chip bottom source semiconductor device and preparation method thereof | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Xiaotian Zhang, Zhi Qiang Niu +4 more | 2015-02-10 |
| 8933518 | Stacked power semiconductor device using dual lead frame | Yan Xun Xue, Lei Shi, Jun Lu, Liang Zhao | 2015-01-13 |
| 8890296 | Wafer level chip scale package | Yan Xun Xue | 2014-11-18 |
| 8865523 | Semiconductor package and fabrication method thereof | Yan Xun Xue, Jun Lu, Lei Shi, Liang Zhao, Ping Huang | 2014-10-21 |
| 8815649 | Multi-layer lead frame package and method of fabrication | Jun Lu, Ming Sun, Kai Liu, Lei Shi | 2014-08-26 |
| 8796858 | Virtually substrate-less composite power semiconductor device | Tao Feng | 2014-08-05 |