Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9040356 | Semiconductor including cup-shaped leadframe packaging techniques | Mike F. Chang, King Owyang, Yueh-Se Ho, Mohammed Kasem, Lixiong Luo | 2015-05-26 |
| 7595547 | Semiconductor die package including cup-shaped leadframe | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo | 2009-09-29 |
| 6909170 | Semiconductor assembly with package using cup-shaped lead-frame | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo | 2005-06-21 |
| 6744124 | Semiconductor die package including cup-shaped leadframe | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo | 2004-06-01 |