Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9040356 | Semiconductor including cup-shaped leadframe packaging techniques | Mike F. Chang, King Owyang, Yueh-Se Ho, Mohammed Kasem, Wei-Bing Chu | 2015-05-26 |
| 7595547 | Semiconductor die package including cup-shaped leadframe | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Wei-Bing Chu | 2009-09-29 |
| 6909170 | Semiconductor assembly with package using cup-shaped lead-frame | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Wei-Bing Chu | 2005-06-21 |
| 6744124 | Semiconductor die package including cup-shaped leadframe | Mike F. Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Wei-Bing Chu | 2004-06-01 |
| 6249041 | IC chip package with directly connected leads | Y. Mohammed Kasem, Anthony C. Tsui, Yueh-Se Ho | 2001-06-19 |