YK

Y. Mohammed Kasem

VI Vishay Intertechnology: 10 patents #1 of 42Top 3%
SI Siliconix Incorporated: 5 patents #25 of 125Top 20%
VI Vishay-Siliconix: 5 patents #21 of 84Top 25%
Overall (All Time): #224,207 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9136060 Precision high-frequency capacitor formed on semiconductor substrate Haim Goldberger, Sik Lui, Jacek Korec, Harianto Wong, Jack Van Den Heuvel 2015-09-15
8324711 Precision high-frequency capacitor formed on semiconductor substrate Haim Goldberger, Sik Lui, Jacek Korec, Harianto Wong, Jack Van Den Heuvel 2012-12-04
8004063 Precision high-frequency capacitor formed on semiconductor substrate Haim Goldberger, Sik Lui, Jacek Korec, Harianto Wong, Jack Van Den Heuvel 2011-08-23
7595547 Semiconductor die package including cup-shaped leadframe Mike F. Chang, King Owyang, Yueh-Se Ho, Lixiong Luo, Wei-Bing Chu 2009-09-29
7589396 Chip scale surface mount package for semiconductor device and process of fabricating the same Felix Zandman, Yueh-Se Ho 2009-09-15
7211877 Chip scale surface mount package for semiconductor device and process of fabricating the same Felix Zandman, Yueh-Se Ho 2007-05-01
7151036 Precision high-frequency capacitor formed on semiconductor substrate Haim Goldberger, Sik Lui, Jacek Korec, Harianto Wong, Jack Van Den Heuvel 2006-12-19
6909170 Semiconductor assembly with package using cup-shaped lead-frame Mike F. Chang, King Owyang, Yueh-Se Ho, Lixiong Luo, Wei-Bing Chu 2005-06-21
6876061 Chip scale surface mount package for semiconductor device and process of fabricating the same Felix Zandman, Yueh-Se Ho 2005-04-05
6744124 Semiconductor die package including cup-shaped leadframe Mike F. Chang, King Owyang, Yueh-Se Ho, Lixiong Luo, Wei-Bing Chu 2004-06-01
6621142 Precision high-frequency capacitor formed on semiconductor substrate Haim Goldberger, Sik Lui, Jacek Korec, Harianto Wong, Jack Van Den Heuvel 2003-09-16
6621143 Precision high-frequency capacitor on semiconductor substrate Haim Goldberger, Sik Lui, Jacek Korec, Harianto Wong, Jack Van Den Heuvel 2003-09-16
6562647 Chip scale surface mount package for semiconductor device and process of fabricating the same Felix Zandman, Yueh-Se Ho 2003-05-13
6538300 Precision high-frequency capacitor formed on semiconductor substrate Haim Goldberger, Sik Lui, Jacek Korec, Harianto Wong, Jack Van Den Heuvel 2003-03-25
6441475 Chip scale surface mount package for semiconductor device and process of fabricating the same Felix Zandman, Yueh-Se Ho 2002-08-27
6392290 Vertical structure for semiconductor wafer-level chip scale packages Yueh-Se Ho, Lee Luo, Chang-Sheng Chen, Eddy Tjhia, Bosco Lan +2 more 2002-05-21
6316287 Chip scale surface mount packages for semiconductor device and process of fabricating the same Felix Zandman, Yueh-Se Ho 2001-11-13
6271060 Process of fabricating a chip scale surface mount package for semiconductor device Felix Zandman, Yueh-Se Ho 2001-08-07
6249041 IC chip package with directly connected leads Anthony C. Tsui, Lixiong Luo, Yueh-Se Ho 2001-06-19
6066890 Separate circuit devices in an intra-package configuration and assembly techniques Anthony C. Tsui 2000-05-23