Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7521360 | Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby | Patrick Halahan, Sam Kao, Sergey Savastiouk, Oleg Siniaguine | 2009-04-21 |
| 6897148 | Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby | Patrick Halahan, Sam Kao, Sergey Savastiouk, Oleg Siniaguine | 2005-05-24 |
| 6392290 | Vertical structure for semiconductor wafer-level chip scale packages | Y. Mohammed Kasem, Yueh-Se Ho, Lee Luo, Chang-Sheng Chen, Eddy Tjhia +2 more | 2002-05-21 |
| 5904525 | Fabrication of high-density trench DMOS using sidewall spacers | Fwu-Iuan Hshieh, Yueh-Se Ho, Jowei Dun | 1999-05-18 |