| 8603575 |
Thin-film absorber formation method |
— |
2013-12-10 |
| 8525152 |
Formation of solar cells with conductive barrier layers and foil substrates |
Craig Leidholm, Brent Bollman, James R. Sheats, Martin R. Roscheisen |
2013-09-03 |
| 8309949 |
Optoelectronic architecture having compound conducting substrate |
James R. Sheats, Martin R. Roscheisen |
2012-11-13 |
| 8198117 |
Photovoltaic devices with conductive barrier layers and foil substrates |
Craig Leidholm, Brent Bollman, James R. Sheats, Martin R. Roscheisen |
2012-06-12 |
| 7968869 |
Optoelectronic architecture having compound conducting substrate |
James R. Sheats, Martin R. Roscheisen |
2011-06-28 |
| 7919337 |
Optoelectronic architecture having compound conducting substrate |
James R. Sheats, Martin R. Roscheisen |
2011-04-05 |
| 7838868 |
Optoelectronic architecture having compound conducting substrate |
James R. Sheats, Martin R. Roscheisen |
2010-11-23 |
| 7732229 |
Formation of solar cells with conductive barrier layers and foil substrates |
Craig Leidholm, Brent Bollman, James R. Sheats, Martin R. Roscheisen |
2010-06-08 |
| 7732232 |
Series interconnected optoelectronic device module assembly |
James R. Sheats, Gregory A. Miller, Martin R. Roscheisen |
2010-06-08 |
| 7521360 |
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby |
Patrick Halahan, Bosco Lan, Sergey Savastiouk, Oleg Siniaguine |
2009-04-21 |
| 7276724 |
Series interconnected optoelectronic device module assembly |
James R. Sheats, Gregory A. Miller, Martin R. Roscheisen |
2007-10-02 |
| 7241641 |
Attachment of integrated circuit structures and other substrates to substrates with vias |
Sergey Savastiouk |
2007-07-10 |
| 7241675 |
Attachment of integrated circuit structures and other substrates to substrates with vias |
Sergey Savastiouk |
2007-07-10 |
| 7186586 |
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
Sergey Savastiouk, Patrick B. Halahan |
2007-03-06 |
| 7060601 |
Packaging substrates for integrated circuits and soldering methods |
Sergey Savastiouk, Patrick B. Halahan |
2006-06-13 |
| 7049170 |
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
Sergey Savastiouk, Patrick B. Halahan |
2006-05-23 |
| 7034401 |
Packaging substrates for integrated circuits and soldering methods |
Sergey Savastiouk, Patrick B. Halahan |
2006-04-25 |
| 6899788 |
Article holders that use gas vortices to hold an article in a desired position |
— |
2005-05-31 |
| 6897148 |
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby |
Patrick Halahan, Bosco Lan, Sergey Savastiouk, Oleg Siniaguine |
2005-05-24 |
| 6749764 |
Plasma processing comprising three rotational motions of an article being processed |
Oleg Siniaguine, Sergey Savastiouk, Patrick Halahan |
2004-06-15 |
| 6427991 |
Non-contact workpiece holder using vortex chuck with central gas flow |
— |
2002-08-06 |