Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8603575 | Thin-film absorber formation method | — | 2013-12-10 |
| 8525152 | Formation of solar cells with conductive barrier layers and foil substrates | Craig Leidholm, Brent Bollman, James R. Sheats, Martin R. Roscheisen | 2013-09-03 |
| 8309949 | Optoelectronic architecture having compound conducting substrate | James R. Sheats, Martin R. Roscheisen | 2012-11-13 |
| 8198117 | Photovoltaic devices with conductive barrier layers and foil substrates | Craig Leidholm, Brent Bollman, James R. Sheats, Martin R. Roscheisen | 2012-06-12 |
| 7968869 | Optoelectronic architecture having compound conducting substrate | James R. Sheats, Martin R. Roscheisen | 2011-06-28 |
| 7919337 | Optoelectronic architecture having compound conducting substrate | James R. Sheats, Martin R. Roscheisen | 2011-04-05 |
| 7838868 | Optoelectronic architecture having compound conducting substrate | James R. Sheats, Martin R. Roscheisen | 2010-11-23 |
| 7732229 | Formation of solar cells with conductive barrier layers and foil substrates | Craig Leidholm, Brent Bollman, James R. Sheats, Martin R. Roscheisen | 2010-06-08 |
| 7732232 | Series interconnected optoelectronic device module assembly | James R. Sheats, Gregory A. Miller, Martin R. Roscheisen | 2010-06-08 |
| 7521360 | Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby | Patrick Halahan, Bosco Lan, Sergey Savastiouk, Oleg Siniaguine | 2009-04-21 |
| 7276724 | Series interconnected optoelectronic device module assembly | James R. Sheats, Gregory A. Miller, Martin R. Roscheisen | 2007-10-02 |
| 7241641 | Attachment of integrated circuit structures and other substrates to substrates with vias | Sergey Savastiouk | 2007-07-10 |
| 7241675 | Attachment of integrated circuit structures and other substrates to substrates with vias | Sergey Savastiouk | 2007-07-10 |
| 7186586 | Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities | Sergey Savastiouk, Patrick B. Halahan | 2007-03-06 |
| 7060601 | Packaging substrates for integrated circuits and soldering methods | Sergey Savastiouk, Patrick B. Halahan | 2006-06-13 |
| 7049170 | Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities | Sergey Savastiouk, Patrick B. Halahan | 2006-05-23 |
| 7034401 | Packaging substrates for integrated circuits and soldering methods | Sergey Savastiouk, Patrick B. Halahan | 2006-04-25 |
| 6899788 | Article holders that use gas vortices to hold an article in a desired position | — | 2005-05-31 |
| 6897148 | Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby | Patrick Halahan, Bosco Lan, Sergey Savastiouk, Oleg Siniaguine | 2005-05-24 |
| 6749764 | Plasma processing comprising three rotational motions of an article being processed | Oleg Siniaguine, Sergey Savastiouk, Patrick Halahan | 2004-06-15 |
| 6427991 | Non-contact workpiece holder using vortex chuck with central gas flow | — | 2002-08-06 |