Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8513969 | Apparatus and method of testing singulated dies | Benjamin N. Eldridge, David Hsu, Igor Y. Khandros, Charles A. Miller | 2013-08-20 |
| 7733106 | Apparatus and method of testing singulated dies | Benjamin N. Eldridge, David S. Y. Hsu, Igor Y. Khandros, Charles A. Miller | 2010-06-08 |
| 7714598 | Contact carriers (tiles) for populating larger substrates with spring contacts | Benjamin N. Eldridge, Igor Y. Khandros, Gaetan L. Mathieu, William D. Smith | 2010-05-11 |
| 7347702 | Contact carriers (tiles) for populating larger substrates with spring contacts | Benjamin N. Eldridge, Igor Y. Khandros, Gaetan L. Mathieu, William D. Smith | 2008-03-25 |
| 7140883 | Contact carriers (tiles) for populating larger substrates with spring contacts | Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, William D. Smith | 2006-11-28 |
| 7059047 | Sockets for “springed” semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen +1 more | 2006-06-13 |
| 6913468 | Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2005-07-05 |
| 6836962 | Method and apparatus for shaping spring elements | Igor Y. Khandros, Gary W. Grube, Gaetan L. Mathieu | 2005-01-04 |
| 6741085 | Contact carriers (tiles) for populating larger substrates with spring contacts | Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, William D. Smith | 2004-05-25 |
| 6701612 | Method and apparatus for shaping spring elements | Igor Y. Khandros, Gary W. Grube, Gaetan L. Mathieu | 2004-03-09 |
| 6669489 | Interposer, socket and assembly for socketing an electronic component and method of making and using same | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 2003-12-30 |
| 6642625 | Sockets for “springed” semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pederson +1 more | 2003-11-04 |
| 6534856 | Sockets for “springed” semiconductor devices | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen +1 more | 2003-03-18 |
| 6442831 | Method for shaping spring elements | Igor Y. Khandros, Gary W. Grube, Gaetan L. Mathieu | 2002-09-03 |
| 6232149 | "Sockets for ""springed"" semiconductor devices" | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen +1 more | 2001-05-15 |
| 6150186 | Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive | Jimmy Chen, Benjamin N. Eldridge, Junjye Yeh, Gayle Herman | 2000-11-21 |
| 6033935 | "Sockets for ""springed"" semiconductor devices" | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen +1 more | 2000-03-07 |
| 5820014 | Solder preforms | Igor Y. Khandros | 1998-10-13 |
| 5806181 | Contact carriers (tiles) for populating larger substrates with spring contacts | Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, William D. Smith | 1998-09-15 |
| 5772451 | Sockets for electronic components and methods of connecting to electronic components | Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu | 1998-06-30 |
| 5473510 | Land grid array package/circuit board assemblies and methods for constructing the same | — | 1995-12-05 |