DP

David V. Pedersen

FO Formfactor: 39 patents #6 of 177Top 4%
CM Cubic Memory: 9 patents #2 of 6Top 35%
WO Worlds.Com: 3 patents #10 of 246Top 5%
AC Aeris Communications: 1 patents #39 of 58Top 70%
VC Vertical Circuits: 1 patents #12 of 20Top 60%
Overall (All Time): #43,798 of 4,157,543Top 2%
56
Patents All Time

Issued Patents All Time

Showing 25 most recent of 56 patents

Patent #TitleCo-InventorsDate
12236489 Damage prediction system using artificial intelligence Neil Pearson 2025-02-25
11727500 Damage prediction system using artificial intelligence Neil Pearson 2023-08-15
11430069 Damage prediction system using artificial intelligence Neil Pearson 2022-08-30
10079942 Methods and apparatus for implementing telemetry applications on a subscriber identity module Dae Seong Kim, Syed Zaeem Hosain, Hein Dinh Ho, Scott Pedersen 2018-09-18
8011089 Method of repairing segmented contactor Mohammad Eslamy, Harry D. Cobb 2011-09-06
7714235 Lithographically defined microelectronic contact structures Igor Y. Khandros 2010-05-11
7688090 Wafer-level burn-in and test Igor Y. Khandros 2010-03-30
7579269 Microelectronic spring contact elements Benjamin N. Eldridge, Igor Y. Khandros, Gaetan L. Mathieu 2009-08-25
7578057 Method of fabricating segmented contactor Mohammad Eslamy, Harry D. Cobb 2009-08-25
7557596 Test assembly including a test die for testing a semiconductor product die Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten 2009-07-07
7534654 Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component Benjamin N. Eldridge, Igor Y. Khandros 2009-05-19
7345493 Wafer-level burn-in and test Igor Y. Khandros 2008-03-18
7217580 Method for processing an integrated circuit Douglas S. Ondricek 2007-05-15
7215131 Segmented contactor Mohammad Eslamy, Harry D. Cobb 2007-05-08
7202677 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component Benjamin N. Eldridge, Igor Y. Khandros 2007-04-10
7078926 Wafer-level burn-in and test Igor Y. Khandros 2006-07-18
7065870 Segmented contactor Mohammad Eslamy, Harry D. Cobb 2006-06-27
7059047 Sockets for “springed” semiconductor devices Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu +1 more 2006-06-13
6940093 Special contact points for accessing internal circuitry of an integrated circuit Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten 2005-09-06
6825052 Test assembly including a test die for testing a semiconductor product die Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten 2004-11-30
6788094 Wafer-level burn-in and test Igor Y. Khandros 2004-09-07
6766348 Method and system for load-balanced data exchange in distributed network-based resource allocation Charles D. Combs, Jeffrey J. Gold, Brian Mair, David Schear 2004-07-20
6727580 Microelectronic spring contact elements Benjamin N. Eldridge, Igor Y. Khandros, Gaetan L. Mathieu 2004-04-27
6690185 Large contactor with multiple, aligned contactor units Igor Y. Khandros, Ralph G. Whitten 2004-02-10
6664628 Electronic component overlapping dice of unsingulated semiconductor wafer Igor Y. Khandros, Benjamin N. Eldridge, Richard S. Roy, Gaetan L. Mathieu 2003-12-16