| 12236489 |
Damage prediction system using artificial intelligence |
Neil Pearson |
2025-02-25 |
|
| 11727500 |
Damage prediction system using artificial intelligence |
Neil Pearson |
2023-08-15 |
|
| 11430069 |
Damage prediction system using artificial intelligence |
Neil Pearson |
2022-08-30 |
|
| 10079942 |
Methods and apparatus for implementing telemetry applications on a subscriber identity module |
Dae Seong Kim, Syed Zaeem Hosain, Hein Dinh Ho, Scott Pedersen |
2018-09-18 |
|
| 8011089 |
Method of repairing segmented contactor |
Mohammad Eslamy, Harry D. Cobb |
2011-09-06 |
$1,949,000 |
| 7714235 |
Lithographically defined microelectronic contact structures |
Igor Y. Khandros |
2010-05-11 |
$2,093,000 |
| 7688090 |
Wafer-level burn-in and test |
Igor Y. Khandros |
2010-03-30 |
$2,624,000 |
| 7578057 |
Method of fabricating segmented contactor |
Mohammad Eslamy, Harry D. Cobb |
2009-08-25 |
$3,076,000 |
| 7579269 |
Microelectronic spring contact elements |
Benjamin N. Eldridge, Igor Y. Khandros, Gaetan L. Mathieu |
2009-08-25 |
$3,076,000 |
| 7557596 |
Test assembly including a test die for testing a semiconductor product die |
Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten |
2009-07-07 |
$3,992,000 |
| 7534654 |
Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
Benjamin N. Eldridge, Igor Y. Khandros |
2009-05-19 |
$9,648,000 |
| 7345493 |
Wafer-level burn-in and test |
Igor Y. Khandros |
2008-03-18 |
$8,203,000 |
| 7217580 |
Method for processing an integrated circuit |
Douglas S. Ondricek |
2007-05-15 |
$6,891,000 |
| 7215131 |
Segmented contactor |
Mohammad Eslamy, Harry D. Cobb |
2007-05-08 |
$21,538,000 |
| 7202677 |
Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
Benjamin N. Eldridge, Igor Y. Khandros |
2007-04-10 |
$5,875,000 |
| 7078926 |
Wafer-level burn-in and test |
Igor Y. Khandros |
2006-07-18 |
$23,728,000 |
| 7065870 |
Segmented contactor |
Mohammad Eslamy, Harry D. Cobb |
2006-06-27 |
$22,828,000 |
| 7059047 |
Sockets for “springed” semiconductor devices |
Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu +1 more |
2006-06-13 |
$10,660,000 |
| 6940093 |
Special contact points for accessing internal circuitry of an integrated circuit |
Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten |
2005-09-06 |
$4,942,000 |
| 6825052 |
Test assembly including a test die for testing a semiconductor product die |
Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten |
2004-11-30 |
$5,415,000 |
| 6788094 |
Wafer-level burn-in and test |
Igor Y. Khandros |
2004-09-07 |
$7,534,000 |
| 6766348 |
Method and system for load-balanced data exchange in distributed network-based resource allocation |
Charles D. Combs, Jeffrey J. Gold, Brian Mair, David Schear |
2004-07-20 |
|
| 6727580 |
Microelectronic spring contact elements |
Benjamin N. Eldridge, Igor Y. Khandros, Gaetan L. Mathieu |
2004-04-27 |
$3,756,000 |
| 6690185 |
Large contactor with multiple, aligned contactor units |
Igor Y. Khandros, Ralph G. Whitten |
2004-02-10 |
$8,283,000 |
| 6664628 |
Electronic component overlapping dice of unsingulated semiconductor wafer |
Igor Y. Khandros, Benjamin N. Eldridge, Richard S. Roy, Gaetan L. Mathieu |
2003-12-16 |
$6,789,000 |