Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664628 | Electronic component overlapping dice of unsingulated semiconductor wafer | Igor Y. Khandros, Benjamin N. Eldridge, Richard S. Roy, Gaetan L. Mathieu | 2003-12-16 |
| 6644982 | Method and apparatus for the transport and tracking of an electronic component | Douglas S. Ondricek | 2003-11-11 |
| 6640415 | Segmented contactor | Mohammad Eslamy, Harry D. Cobb | 2003-11-04 |
| 6627483 | Method for mounting an electronic component | Douglas S. Ondricek | 2003-09-30 |
| 6621260 | Special contact points for accessing internal circuitry of an integrated circuit | Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten | 2003-09-16 |
| 6603324 | Special contact points for accessing internal circuitry of an integrated circuit | Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten | 2003-08-05 |
| 6597187 | Special contact points for accessing internal circuitry of an integrated circuit | Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten | 2003-07-22 |
| 6551844 | Test assembly including a test die for testing a semiconductor product die | Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten | 2003-04-22 |
| 6534856 | Sockets for “springed” semiconductor devices | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu +1 more | 2003-03-18 |
| 6525555 | Wafer-level burn-in and test | Igor Y. Khandros | 2003-02-25 |
| 6523065 | Method and system for maintenance of global network information in a distributed network-based resource allocation system | Charles D. Combs, Jeffrey J. Gold, Brian Mair, David Schear | 2003-02-18 |
| 6486528 | Silicon segment programming apparatus and three terminal fuse configuration | Michael G. Finley, Kenneth M. Sautter | 2002-11-26 |
| 6456099 | Special contact points for accessing internal circuitry of an integrated circuit | Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten | 2002-09-24 |
| 6429029 | Concurrent design and subsequent partitioning of product and test die | Benjamin N. Eldridge, Igor Y. Khandros, Ralph G. Whitten | 2002-08-06 |
| 6330164 | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device | Igor Y. Khandros, Benjamin N. Eldridge, Richard S. Roy, Gaetan L. Mathieu | 2001-12-11 |
| 6232149 | "Sockets for ""springed"" semiconductor devices" | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu +1 more | 2001-05-15 |
| 6215196 | Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals | Benjamin N. Eldridge, Igor Y. Khandros, Gaetan L. Mathieu | 2001-04-10 |
| 6188126 | Vertical interconnect process for silicon segments | Michael G. Finley, Kenneth M. Sautter | 2001-02-13 |
| 6184053 | Method of making microelectronic spring contact elements | Benjamin N. Eldridge, Igor Y. Khandros, Gaetan L. Mathieu | 2001-02-06 |
| 6134118 | Conductive epoxy flip-chip package and method | Michael G. Finley, Kenneth M. Sautter | 2000-10-17 |
| 6064213 | Wafer-level burn-in and test | Igor Y. Khandros | 2000-05-16 |
| 6043563 | Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals | Benjamin N. Eldridge, Igor Y. Khandros, Gaetan L. Mathieu | 2000-03-28 |
| 6033935 | "Sockets for ""springed"" semiconductor devices" | Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu +1 more | 2000-03-07 |
| 5998864 | Stacking semiconductor devices, particularly memory chips | Igor Y. Khandros | 1999-12-07 |
| 5994170 | Silicon segment programming method | Michael G. Finley, Kenneth M. Sautter | 1999-11-30 |