Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8558368 | Bi-directional, reverse blocking battery switch | James Harnden, Anthony Chia, Liming Wong, Hongbo Yang, Hui Teng +1 more | 2013-10-15 |
| 8358017 | Semiconductor package featuring flip-chip die sandwiched between metal layers | — | 2013-01-22 |
| 8120154 | Interconnection of lead frame to die utilizing flip chip process | Mohammad Eslamy | 2012-02-21 |
| 8106493 | Semiconductor device package having features formed by stamping | Mohammad Eslamy, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu | 2012-01-31 |
| 8097945 | Bi-directional, reverse blocking battery switch | James Harnden, Anthony Chia, Liming Wong, Hongbo Yang, Hui Teng +1 more | 2012-01-17 |
| 7838339 | Semiconductor device package having features formed by stamping | Mohammad Eslamy, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu | 2010-11-23 |
| 7691670 | Interconnection of lead frame to die utilizing flip chip process | Mohammad Eslamy | 2010-04-06 |
| 6277695 | Method of forming vertical planar DMOSFET with self-aligned contact | Richard K. Williams, Sung-Shan Tai, Dorman C. Pitzer, Wayne B. Grabowski, Mike F. Chang | 2001-08-21 |
| 6249041 | IC chip package with directly connected leads | Y. Mohammed Kasem, Lixiong Luo, Yueh-Se Ho | 2001-06-19 |
| 6066890 | Separate circuit devices in an intra-package configuration and assembly techniques | Y. Mohammed Kasem | 2000-05-23 |