Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032901 | Semiconductor device with trench-like feed-throughs | Deva Pattanayak, King Owyang, Kyle Terrill, Reuven Katraro, Kuo-In Chen +5 more | 2018-07-24 |
| 9306056 | Semiconductor device with trench-like feed-throughs | Deva Pattanayak, King Owyang, Kyle Terrill, Reuven Katraro, Kuo-In Chen +5 more | 2016-04-05 |
| 9093359 | Complete power management system implemented in a single surface mount package | King Owyang, Yuming Bai, Frank Kuo, Sen Mao, Sam Kuo | 2015-07-28 |
| 9040356 | Semiconductor including cup-shaped leadframe packaging techniques | Mike F. Chang, King Owyang, Yueh-Se Ho, Lixiong Luo, Wei-Bing Chu | 2015-05-26 |
| 8928138 | Complete power management system implemented in a single surface mount package | King Owyang, Yuming Bai, Frank Kuo, Sen Mao, Sam Kuo | 2015-01-06 |
| 8471381 | Complete power management system implemented in a single surface mount package | King Owyang, Yuming Bai, Frank Kuo, Sen Mao, Sam Kuo | 2013-06-25 |
| 7394150 | Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys | King Owyang, Frank Kuo, Serge Jaunay, Sen Mao, Oscar Ou +2 more | 2008-07-01 |
| 7238551 | Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys | King Owyang, Frank Kuo, Serge Jaunay, Sen Mao, Oscar Ou +2 more | 2007-07-03 |
| 6858471 | Semiconductor substrate with trenches for reducing substrate resistance | Jacek Korec, Robert Xu | 2005-02-22 |
| 6414362 | Power semiconductor device | Frank Kuo, Sen Mao, Oscar Ou, Sam Kuo | 2002-07-02 |