Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546840 | Method for fabricating stack die package | Kyle Terrill, Sen Mao | 2020-01-28 |
| 10229893 | Dual lead frame semiconductor package and method of manufacture | Suresh Belani | 2019-03-12 |
| 9966330 | Stack die package | Kyle Terrill, Sen Mao | 2018-05-08 |
| 9595503 | Dual lead frame semiconductor package and method of manufacture | Suresh Belani | 2017-03-14 |
| 9589929 | Method for fabricating stack die package | Kyle Terrill, Sen Mao | 2017-03-07 |
| 9567027 | Bicycle seat post height adjustment mechanism | — | 2017-02-14 |
| 9376153 | Control device of the height adjustment for a bicycle seat post | — | 2016-06-28 |
| 9376159 | Direction restricting device for the inner and outer tubes of a bicycle seat post | — | 2016-06-28 |
| 9187141 | Control mechanism of the adjustable seat post for a bicycle | — | 2015-11-17 |
| 9184152 | Dual lead frame semiconductor package and method of manufacture | Suresh Belani | 2015-11-10 |
| 9126647 | Bicycle seat post structure | — | 2015-09-08 |
| 9093359 | Complete power management system implemented in a single surface mount package | King Owyang, Mohammed Kasem, Yuming Bai, Sen Mao, Sam Kuo | 2015-07-28 |
| 8928157 | Encapsulation techniques for leadless semiconductor packages | — | 2015-01-06 |
| 8928138 | Complete power management system implemented in a single surface mount package | King Owyang, Mohammed Kasem, Yuming Bai, Sen Mao, Sam Kuo | 2015-01-06 |
| 8822273 | Dual lead frame semiconductor package and method of manufacture | Suresh Belani | 2014-09-02 |
| 8586419 | Semiconductor packages including die and L-shaped lead and method of manufacture | Serge Jaunay, Suresh Belani, Sen Mao, Peter Wang | 2013-11-19 |
| 8471381 | Complete power management system implemented in a single surface mount package | King Owyang, Mohammed Kasem, Yuming Bai, Sen Mao, Sam Kuo | 2013-06-25 |
| 7501086 | Encapsulation method for leadless semiconductor packages | — | 2009-03-10 |
| 7394150 | Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys | Mohammed Kasem, King Owyang, Serge Jaunay, Sen Mao, Oscar Ou +2 more | 2008-07-01 |
| 7238551 | Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys | Mohammed Kasem, King Owyang, Serge Jaunay, Sen Mao, Oscar Ou +2 more | 2007-07-03 |
| 6856006 | Encapsulation method and leadframe for leadless semiconductor packages | — | 2005-02-15 |
| 6744119 | Leadframe having slots in a die pad | Sen Mao, Sam Kuo, Oscar Ou | 2004-06-01 |
| D472528 | Semiconductor chip package | Yehja Mohammed Kasem, Eddy Tjhia | 2003-04-01 |
| D466873 | Semiconductor chip package | Yehja Mohammed Kasem, Eddy Tjhia | 2002-12-10 |
| 6465276 | Power semiconductor package and method for making the same | — | 2002-10-15 |