| 10546840 |
Method for fabricating stack die package |
Kyle Terrill, Frank Kuo |
2020-01-28 |
| 10090298 |
Integrated packaging structure |
Chien-Chung Chen, Hsin-Liang Lin |
2018-10-02 |
| 10056355 |
Common-source packaging structure |
Chien-Chung Chen, Hsin-Liang Lin |
2018-08-21 |
| 9997500 |
Common-source packaging structure |
Chien-Chung Chen, Hsin-Liang Lin |
2018-06-12 |
| 9966330 |
Stack die package |
Kyle Terrill, Frank Kuo |
2018-05-08 |
| 9589929 |
Method for fabricating stack die package |
Kyle Terrill, Frank Kuo |
2017-03-07 |
| 9093359 |
Complete power management system implemented in a single surface mount package |
King Owyang, Mohammed Kasem, Yuming Bai, Frank Kuo, Sam Kuo |
2015-07-28 |
| 8928138 |
Complete power management system implemented in a single surface mount package |
King Owyang, Mohammed Kasem, Yuming Bai, Frank Kuo, Sam Kuo |
2015-01-06 |
| 8586419 |
Semiconductor packages including die and L-shaped lead and method of manufacture |
Serge Jaunay, Suresh Belani, Frank Kuo, Peter Wang |
2013-11-19 |
| 8471381 |
Complete power management system implemented in a single surface mount package |
King Owyang, Mohammed Kasem, Yuming Bai, Frank Kuo, Sam Kuo |
2013-06-25 |
| 7394150 |
Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys |
Mohammed Kasem, King Owyang, Frank Kuo, Serge Jaunay, Oscar Ou +2 more |
2008-07-01 |
| 7238551 |
Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys |
Mohammed Kasem, King Owyang, Frank Kuo, Serge Jaunay, Oscar Ou +2 more |
2007-07-03 |
| 6744119 |
Leadframe having slots in a die pad |
Frank Kuo, Sam Kuo, Oscar Ou |
2004-06-01 |
| 6414362 |
Power semiconductor device |
Frank Kuo, Mohammed Kasem, Oscar Ou, Sam Kuo |
2002-07-02 |