Issued Patents All Time
Showing 25 most recent of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482601 | Methods of manufacture of termination for vertical trench shielded devices | Jun Hu, M. Ayman Shibib, Misbah Ul Azam | 2022-10-25 |
| 11295949 | Virtual wafer techniques for fabricating semiconductor devices | M. Ayman Shibib | 2022-04-05 |
| 11217541 | Transistors with electrically active chip seal ring and methods of manufacture | M. Ayman Shibib | 2022-01-04 |
| 11189702 | Split gate semiconductor with non-uniform trench oxide | M. Ayman Shibib, Misbah Ul Azam, Chanho Park | 2021-11-30 |
| 11114559 | Semiconductor device having reduced gate charges and superior figure of merit | Chanho Park | 2021-09-07 |
| 11004841 | Semiconductor device having multiple gate pads | Chanho Park, Ayman Shibib | 2021-05-11 |
| 10950699 | Termination for vertical trench shielded devices | Jun Hu, M. Ayman Shibib, Misbah Ul Azam | 2021-03-16 |
| 10930591 | Trench MOSFET with self-aligned body contact with spacer | Lingpeng Guan, Seokjin Jo | 2021-02-23 |
| 10903163 | Trench MOSFET with self-aligned body contact with spacer | Lingpeng Guan, Seokjin Jo | 2021-01-26 |
| 10665711 | High-electron-mobility transistor with buried interconnect | Ayman Shibib, Yongping Ding, Jinman YANG | 2020-05-26 |
| 10651303 | High-electron-mobility transistor devices | Ayman Shibib | 2020-05-12 |
| 10630071 | Current limiting systems and methods | Trang Vu | 2020-04-21 |
| 10546750 | System and method for substrate wafer back side and edge cross section seals | Hamilton Lu, The-Tu Chau, Deva Pattanayak, Sharon Shi, Kuo-In Chen +1 more | 2020-01-28 |
| 10546840 | Method for fabricating stack die package | Frank Kuo, Sen Mao | 2020-01-28 |
| 10453953 | Structures and methods of fabricating dual gate devices | Yuming Bai, Deva Pattanayak, Zhiyun Luo | 2019-10-22 |
| 10381473 | High-electron-mobility transistor with buried interconnect | Ayman Shibib, Yongping Ding, Jinman YANG | 2019-08-13 |
| 10256227 | Semiconductor device having multiple gate pads | Chanho Park, Ayman Shibib | 2019-04-09 |
| 10224426 | High-electron-mobility transistor devices | Ayman Shibib | 2019-03-05 |
| 10181523 | Transistor structure with improved unclamped inductive switching immunity | Wenjie Zhang, Madhur Bobde, Qufei Chen | 2019-01-15 |
| 10084037 | MOSFET active area and edge termination area charge balance | Qufei Chen, Sharon Shi | 2018-09-25 |
| 10032901 | Semiconductor device with trench-like feed-throughs | Deva Pattanayak, King Owyang, Mohammed Kasem, Reuven Katraro, Kuo-In Chen +5 more | 2018-07-24 |
| 9978859 | Semiconductor device with non-uniform trench oxide layer | Chanho Park, Ayman Shibib | 2018-05-22 |
| 9966330 | Stack die package | Frank Kuo, Sen Mao | 2018-05-08 |
| 9935193 | MOSFET termination trench | Misbah Ul Azam | 2018-04-03 |
| 9893168 | Split gate semiconductor device with curved gate oxide profile | Yang Gao, Kuo-In Chen, Sharon Shi | 2018-02-13 |