Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7394150 | Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys | Mohammed Kasem, King Owyang, Frank Kuo, Serge Jaunay, Sen Mao +2 more | 2008-07-01 |
| 7238551 | Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys | Mohammed Kasem, King Owyang, Frank Kuo, Serge Jaunay, Sen Mao +2 more | 2007-07-03 |
| 6744119 | Leadframe having slots in a die pad | Frank Kuo, Sen Mao, Sam Kuo | 2004-06-01 |
| 6414362 | Power semiconductor device | Frank Kuo, Mohammed Kasem, Sen Mao, Sam Kuo | 2002-07-02 |