Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8586419 | Semiconductor packages including die and L-shaped lead and method of manufacture | Suresh Belani, Frank Kuo, Sen Mao, Peter Wang | 2013-11-19 |
| 7394150 | Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys | Mohammed Kasem, King Owyang, Frank Kuo, Sen Mao, Oscar Ou +2 more | 2008-07-01 |
| 7238551 | Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys | Mohammed Kasem, King Owyang, Frank Kuo, Sen Mao, Oscar Ou +2 more | 2007-07-03 |