Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12117810 | AI-based determination of action plan for manufacturing component carriers | Tim Lu | 2024-10-15 |
| 11293979 | Method of and an arrangement for analyzing manufacturing defects of multi-chip modules made without known good die | — | 2022-04-05 |
| 11256762 | System and method for efficiently determining and displaying optimal packages of data items | Xiangnong Wang, Yifei Huang, Michael Yang, Francis Chen, Andy Chen +6 more | 2022-02-22 |
| 8586419 | Semiconductor packages including die and L-shaped lead and method of manufacture | Serge Jaunay, Suresh Belani, Frank Kuo, Sen Mao | 2013-11-19 |
| 8188759 | Dry high potential tester and solar simulator tool | Harry Whitesell, Danny Cam Toan Lu, Tzay-Fa Su, Michael Marriott, Xue Hong Ma +2 more | 2012-05-29 |
| 7394150 | Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys | Mohammed Kasem, King Owyang, Frank Kuo, Serge Jaunay, Sen Mao +2 more | 2008-07-01 |
| 7336340 | Method of exposure error adjustment in photolithography for multiple products | — | 2008-02-26 |
| 7238551 | Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys | Mohammed Kasem, King Owyang, Frank Kuo, Serge Jaunay, Sen Mao +2 more | 2007-07-03 |
| 6437436 | Integrated circuit chip package with test points | Yu-Wen Huang | 2002-08-20 |
| 6344688 | Very thin multi-chip package and method of mass producing the same | — | 2002-02-05 |
| 6100113 | Very thin multi-chip-package and method of mass producing the same | — | 2000-08-08 |
| 6026564 | Method of making a high density multilayer wiring board | Yu-Wen Huang | 2000-02-22 |
| 5467271 | Mapping and analysis system for precision farming applications | Robert J. Abel, Michael Charles MacDonald | 1995-11-14 |