Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Zhiqiang Niu | 2016-12-13 |
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Zhiqiang Niu +2 more | 2016-01-26 |
| 8703545 | Aluminum alloy lead-frame and its use in fabrication of power semiconductor package | Zhiqiang Niu, Ming-Chen Lu, Yan Xun Xue, Yan Huo, Hua Pan +1 more | 2014-04-22 |