Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12423954 | Image recognition method, device, electronic device, and storage medium | Minghao Zhu, Zhaojian Liu, Qifeng Wang, Xuehan LI, Qinghe Gao +1 more | 2025-09-23 |
| 12354241 | Diffusion-based multiple-modality image fusion | Zhihan Wang | 2025-07-08 |
| 12057864 | Hardware implementation of frequency table generation for Asymmetric-Numeral-System-based data compression | Hing-Mo Lam, Hailiang Li, Ho Yu Wong, Tao Li, Ka Lung Tim Wong | 2024-08-06 |
| 11962333 | Predicting compression ratio of data with compressible decision | Hailiang Li, Tao Li | 2024-04-16 |
| 11750213 | Train-linking lossless compressor of numeric values | Hailiang Li, Tao Li | 2023-09-05 |
| 11468543 | Neural-network for raw low-light image enhancement | Li-Wen Wang, Wan Chi Siu, Zhi-Song Liu, Xingbo Guan, Miaohui Hao | 2022-10-11 |
| 10504823 | Power semiconductor device with small contact footprint and the preparation method | Hongtao Gao, Jun Lu, Ming-Chen Lu, Jianxin Ye, Hua Pan | 2019-12-10 |
| 10043736 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Zhiqiang Niu +1 more | 2018-08-07 |
| 9653383 | Semiconductor device with thick bottom metal and preparation method thereof | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Ming-Chen Lu, Aihua Lu | 2017-05-16 |
| 9646920 | Power semiconductor device with small contact footprint and the preparation method | Hongtao Gao, Jun Lu, Ming-Chen Lu, Jianxin Ye, Hua Pan | 2017-05-09 |
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Zhiqiang Niu +1 more | 2016-08-23 |
| 9337127 | Ultra-thin semiconductor device and preparation method thereof | — | 2016-05-10 |
| 9337131 | Power semiconductor device and the preparation method | Hamza Yilmaz, Jun Lu, Ming-Chen Lu, Zhi Qiang Niu, Yan Xun Xue +1 more | 2016-05-10 |
| 9245831 | Top-exposed semiconductor package and the manufacturing method | Zhi Qiang Niu, Ming-Chen Lu, Hongtao Gao | 2016-01-26 |
| 9117809 | Ultra-thin semiconductor device and preparation method thereof | — | 2015-08-25 |
| 9087378 | Scale changing detection and scaling ratio determination by using motion information | Chunhui Cui, Chun-Fu Chen, Ciao-Siang Siao, Gwo Giun Lee | 2015-07-21 |
| 9087828 | Semiconductor device with thick bottom metal and preparation method thereof | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Ming-Chen Lu, Aihua Lu | 2015-07-21 |
| 9054091 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Zhiqiang Niu +1 more | 2015-06-09 |
| 8703545 | Aluminum alloy lead-frame and its use in fabrication of power semiconductor package | Zhiqiang Niu, Ming-Chen Lu, Yan Xun Xue, Hua Pan, Guo Feng Lian +1 more | 2014-04-22 |
| 8498330 | Method and apparatus for coding mode selection | Yan Ho Kam, Wan Chi Siu, Yui Lam CHAN, Wai Lam HUI, Wai Hong Wong +1 more | 2013-07-30 |
| 8326050 | Method and apparatus for subpixel-based down-sampling | Oscar Chi-Lim Au, Lu Fang, Hon Wah Wong, Yi Yang | 2012-12-04 |
| 8259819 | Method and apparatus for improving video quality by utilizing a unified loop filter | Yu-Jung Liu, Ka Man Cheng | 2012-09-04 |
| 8228983 | Method and device for order-16 integer transform from order-8 integer cosine transform | Wai Kuen Cham, Chi Keung Fong, Jie Dong, King Ngi Ngan, Hoi Ming Wong +2 more | 2012-07-24 |
| 8165211 | Method and apparatus of de-interlacing video | King Ngi Ngan, Jie Dong | 2012-04-24 |
| 8090031 | Method for motion compensation | Hoi Ming Wong | 2012-01-03 |