Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12220789 | High-rotational speed cup-shaped grinding wheel | Jingxin SONG, Anning LIANG, Huiling LONG, Yong YE, Zhiyong Wang +1 more | 2025-02-11 |
| 12031384 | Cutting elements having non-planar surfaces and downhole cutting tools using such cutting elements | Chen Chen, Huimin Song, Youhe Zhang, Michael G. Azar, Xiaoge Gan +4 more | 2024-07-09 |
| 11306542 | Thermally stable polycrystalline diamond and methods of making the same | Yahua Bao, J. Daniel Belnap, Zhijun Lin | 2022-04-19 |
| 11215012 | Cutting elements having non-planar surfaces and downhole cutting tools using such cutting elements | Chen Chen, Huimin Song, Youhe Zhang, Michael G. Azar, Xiaoge Gan +4 more | 2022-01-04 |
| 10563464 | Convex ridge type non-planar cutting tooth and diamond drill bit | Javier Davila, Xiaomin Cheng, Demin Chen, Xiongwen Yang, Yonghong Wang +1 more | 2020-02-18 |
| 10350733 | Ultra-hard material cutting elements and methods of manufacturing the same with a metal-rich intermediate layer | Xiaoge Gan, Yahua Bao, Yuri Burhan, Youhe Zhang, J. Daniel Belnap +1 more | 2019-07-16 |
| 10287825 | Cutting elements having non-planar surfaces and downhole cutting tools using such cutting elements | Chen Chen, Huimin Song, Youhe Zhang, Michael G. Azar, Xiaoge Gan +4 more | 2019-05-14 |
| 10125552 | Convex ridge type non-planar cutting tooth and diamond drill bit | Xiaomin Cheng, Demin Chen, Xiongwen Yang, Yonghong Wang, YU-LIN LIU | 2018-11-13 |
| 10105824 | Chemical leaching/thermal decomposing carbonate in carbonate PCD | Yahua Bao, J. Daniel Belnap | 2018-10-23 |
| 9840876 | Polycrystalline diamond compact cutter | Xiaomin Cheng, Ning Li | 2017-12-12 |
| 9746403 | Method of testing a polycrystalline diamond compact cutter | Xiaomin Cheng, Xueqing Teng | 2017-08-29 |
| 9422770 | Method for braze joining of carbonate PCD | J. Daniel Belnap, Yahua Bao, Youhe Zhang, Zhijun Lin | 2016-08-23 |
| 9391005 | Method for packaging a power device with bottom source electrode | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Jun Lu, Lei Shi +1 more | 2016-07-12 |
| 9281265 | Packaging structure of a semiconductor device | Yueh-Se Ho, Yan Xun Xue, Jun Lu, Lei Shi, Ping Huang | 2016-03-08 |
| 9196534 | Method for preparing semiconductor devices applied in flip chip technology | Yan Xun Xue, Ping Huang, Hamza Yilmaz, Yueh-Se Ho, Lei Shi +3 more | 2015-11-24 |
| 8952509 | Stacked multi-chip bottom source semiconductor device and preparation method thereof | Hamza Yilmaz, Yueh-Se Ho, Yan Xun Xue, Jun Lu, Xiaotian Zhang +4 more | 2015-02-10 |
| 8933518 | Stacked power semiconductor device using dual lead frame | Yan Xun Xue, Yueh-Se Ho, Lei Shi, Jun Lu | 2015-01-13 |
| 8865523 | Semiconductor package and fabrication method thereof | Yueh-Se Ho, Yan Xun Xue, Jun Lu, Lei Shi, Ping Huang | 2014-10-21 |
| 8841167 | Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFET | Yuping Gong, Yan Xun Xue | 2014-09-23 |
| 8564110 | Power device with bottom source electrode | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Jun Lu, Lei Shi +1 more | 2013-10-22 |
| 8519520 | Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method | Yuping Gong, Yan Xun Xue | 2013-08-27 |
| 8436429 | Stacked power semiconductor device using dual lead frame and manufacturing method | Yan Xun Xue, Yueh-Se Ho, Lei Shi, Jun Lu | 2013-05-07 |
| 8431993 | Semiconductor package for forming a leadframe package | Yan Xun Xue, Jun Lu, Lei Shi | 2013-04-30 |
| 8076183 | Method of attaching an interconnection plate to a semiconductor die within a leadframe package | Yan Xun Xue, Jun Lu, Le Shi | 2011-12-13 |
| 7943424 | Encapsulation method for packaging semiconductor components with external leads | Limin Wang, Lei Shi, Feng Ye | 2011-05-17 |