Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581195 | Semiconductor package having wettable lead flank and method of making the same | Yan Xun Xue, Long Wang, Lei Fukuda, Adrian Chee Heong Koh, Peter H. Wilson | 2023-02-14 |
| 11082041 | Switching circuit and operation method | Hu FU, Zuo-Hui Peng, Jian Wang, Yu Qi | 2021-08-03 |
| 7943424 | Encapsulation method for packaging semiconductor components with external leads | Limin Wang, Lei Shi, Liang Zhao | 2011-05-17 |
| 7298565 | Compact and high performance opto-mechanical switch | Yong Wang | 2007-11-20 |