Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9087828 | Semiconductor device with thick bottom metal and preparation method thereof | Hamza Yilmaz, Yan Xun Xue, Ming-Chen Lu, Yan Huo, Aihua Lu | 2015-07-21 |
| 9054091 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2015-06-09 |
| 9041172 | Semiconductor device for restraining creep-age phenomenon and fabricating method thereof | Zhi Qiang Niu, Hamza Yilmaz, Fei Wang | 2015-05-26 |
| 9040357 | Semiconductor packaging method using connecting plate for internal connection | Kai Liu, Yan Xun Xue | 2015-05-26 |
| 9006901 | Thin power device and preparation method thereof | Yuping Gong, Yan Xun Xue, Ming-Chen Lu, Ping Huang, Hamza Yilmaz | 2015-04-14 |
| 9006870 | Stacked multi-chip packaging structure and manufacturing method thereof | Xiaotian Zhang, Hua Pan, Ming-Chen Lu, Hamza Yilmaz | 2015-04-14 |
| 8952509 | Stacked multi-chip bottom source semiconductor device and preparation method thereof | Hamza Yilmaz, Yueh-Se Ho, Yan Xun Xue, Xiaotian Zhang, Zhi Qiang Niu +4 more | 2015-02-10 |
| 8933550 | Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors | Yan Xun Xue, Anup Bhalla | 2015-01-13 |
| 8933549 | Dual-leadframe multi-chip package | Kai Liu, Lei Shi, Anup Bhalla | 2015-01-13 |
| 8933518 | Stacked power semiconductor device using dual lead frame | Yan Xun Xue, Yueh-Se Ho, Lei Shi, Liang Zhao | 2015-01-13 |
| 8865523 | Semiconductor package and fabrication method thereof | Yueh-Se Ho, Yan Xun Xue, Lei Shi, Liang Zhao, Ping Huang | 2014-10-21 |
| 8815649 | Multi-layer lead frame package and method of fabrication | Ming Sun, Yueh-Se Ho, Kai Liu, Lei Shi | 2014-08-26 |
| 8778735 | Packaging method of molded wafer level chip scale package (WLCSP) | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Ping Huang, Lei Shi +2 more | 2014-07-15 |
| 8722466 | Semiconductor packaging and fabrication method using connecting plate for internal connection | Kai Liu, Yan Xun Xue | 2014-05-13 |
| 8722468 | Semiconductor encapsulation method | Yan Xun Xue, Anup Bhalla | 2014-05-13 |
| 8709867 | Dual-leadframe multi-chip package and method of manufacture | Kai Liu, Lei Shi, Anup Bhalla | 2014-04-29 |
| 8709893 | Method of making a low-Rdson vertical power MOSFET device | Yi Su, Daniel Ng, Anup Bhalla | 2014-04-29 |
| 8703545 | Aluminum alloy lead-frame and its use in fabrication of power semiconductor package | Zhiqiang Niu, Ming-Chen Lu, Yan Xun Xue, Yan Huo, Hua Pan +1 more | 2014-04-22 |
| 8686546 | Combined packaged power semiconductor device | Yueh-Se Ho, Hamza Yilmaz, Yan Xun Xue | 2014-04-01 |
| 8669650 | Flip chip semiconductor device | Xiaotian Zhang, Hamza Yilmaz, Xiaoguang Zeng, Ming-Chen Lu | 2014-03-11 |
| 8642385 | Wafer level package structure and the fabrication method thereof | Yan Xun Xue, Ping Huang, Yueh-Se Ho, Hamza Yilmaz, Ming-Chen Lu | 2014-02-04 |
| 8586414 | Top exposed package and assembly method | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Kal Liu | 2013-11-19 |
| 8581376 | Stacked dual chip package and method of fabrication | Hamza Yilmaz, Xiaotian Zhang, Yan Xun Xue, Anup Bhalla, Kai Liu +2 more | 2013-11-12 |
| 8575006 | Process to form semiconductor packages with external leads | Yan Xun Xue | 2013-11-05 |
| 8563360 | Power semiconductor device package and fabrication method | Francois Hebert, Kai Liu, Xiaotian Zhang | 2013-10-22 |