Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8564110 | Power device with bottom source electrode | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Lei Shi, Liang Zhao +1 more | 2013-10-22 |
| 8563417 | Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process | Alex Niu, Yueh-Se Ho, Ping Hoang, Jacky Gong, Yan Xun Xue +2 more | 2013-10-22 |
| 8563361 | Packaging method of molded wafer level chip scale package (WLCSP) | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Ping Huang, Lei Shi +2 more | 2013-10-22 |
| 8519525 | Semiconductor encapsulation and method thereof | Yan Xun Xue, Anup Bhalla | 2013-08-27 |
| 8513784 | Multi-layer lead frame package and method of fabrication | Ming Sun, Yueh-Se Ho, Kai Liu, Lei Shi | 2013-08-20 |
| 8482048 | Metal oxide semiconductor field effect transistor integrating a capacitor | Yan Xun Xue, Anup Bhalla, Hamza Yilmaz | 2013-07-09 |
| 8481368 | Semiconductor package of a flipped MOSFET and its manufacturing method | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz | 2013-07-09 |
| 8476752 | Package structure for DC-DC converter | Yueh-Se Ho, Yan Xun Xue | 2013-07-02 |
| 8455303 | Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method | Xiaotian Zhang | 2013-06-04 |
| 8436429 | Stacked power semiconductor device using dual lead frame and manufacturing method | Yan Xun Xue, Yueh-Se Ho, Lei Shi, Liang Zhao | 2013-05-07 |
| 8431993 | Semiconductor package for forming a leadframe package | Yan Xun Xue, Lei Shi, Liang Zhao | 2013-04-30 |
| 8344519 | Stacked-die package for battery power management | Allen Timothy Chang, Xiaotian Zhang | 2013-01-01 |
| 8302287 | Method of manufacturing a multilayer inductor | Francois Hebert | 2012-11-06 |
| 8283212 | Method of making a copper wire bond package | Yan Xun Xue, Anup Bhalla | 2012-10-09 |
| 8247288 | Method of integrating a MOSFET with a capacitor | Yan Xun Xue, Anup Bhalla, Hamza Yilmaz | 2012-08-21 |
| 8222088 | Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method | Xiaotian Zhang | 2012-07-17 |
| 8217503 | Package structure for DC-DC converter | Yueh-Se Ho, Yan Xun Xue | 2012-07-10 |
| 8178954 | Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors | Yan Xun Xue, Anup Bhalla | 2012-05-15 |
| 8154108 | Dual-leadframe multi-chip package and method of manufacture | Kai Liu, Lei Shi, Anup Bhalla | 2012-04-10 |
| 8076183 | Method of attaching an interconnection plate to a semiconductor die within a leadframe package | Yan Xun Xue, Le Shi, Liang Zhao | 2011-12-13 |
| 8058961 | Lead frame-based discrete power inductor | Francois Hebert, Tao Feng, Xiaotian Zhang | 2011-11-15 |
| 8049315 | Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package | Anup Bhalla, Xiaobin Wang, Allen Timothy Chang, Kenny Hu, Xiaotian Zhang | 2011-11-01 |
| 7971340 | Planar grooved power inductor structure and method | Francois Hebert, Tao Feng | 2011-07-05 |
| 7948346 | Planar grooved power inductor structure and method | Francois Hebert, Tao Feng | 2011-05-24 |
| 7939370 | Power semiconductor package | Francois Hebert | 2011-05-10 |