Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8563417 | Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process | Jun Lu, Alex Niu, Yueh-Se Ho, Jacky Gong, Yan Xun Xue +2 more | 2013-10-22 |