Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Zhiqiang Niu, Guo Feng Lian | 2016-12-13 |
| 9472491 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Ming-Chen Lu, Hongtao Gao | 2016-10-18 |
| 9437587 | Flip chip semiconductor device | Xiaotian Zhang, Hamza Yilmaz, Xiaoguang Zeng, Ming-Chen Lu | 2016-09-06 |
| 9437530 | Combined packaged power semiconductor device | Yueh-Se Ho, Hamza Yilmaz, Yan Yun Xue | 2016-09-06 |
| 9437528 | Dual-side exposed semiconductor package with ultra-thin die and manufacturing method thereof | Yuping Gong, Xiaoming Sui, Yan Yun Xue | 2016-09-06 |
| 9431328 | Power device and preparation method thereof | Hamza Yilmaz, Yan Xun Xue | 2016-08-30 |
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2016-08-23 |
| 9412684 | Top exposed semiconductor chip package | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Kai Liu | 2016-08-09 |
| 9397029 | Power semiconductor package device having locking mechanism, and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, De Mei Gong | 2016-07-19 |
| 9391005 | Method for packaging a power device with bottom source electrode | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Lei Shi, Liang Zhao +1 more | 2016-07-12 |
| 9337131 | Power semiconductor device and the preparation method | Yan Huo, Hamza Yilmaz, Ming-Chen Lu, Zhi Qiang Niu, Yan Xun Xue +1 more | 2016-05-10 |
| 9318603 | Method of making a low-Rdson vertical power MOSFET device | Yi Su, Daniel Ng, Anup Bhalla | 2016-04-19 |
| 9318424 | MCSP power semiconductor devices and preparation methods thereof | Zhiqiang Niu, Hamza Yilmaz, Hongtao Gao | 2016-04-19 |
| 9305870 | Power semiconductor device and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho | 2016-04-05 |
| 9293397 | Power device and preparation method thereof | Hamza Yilmaz, Yan Xun Xue | 2016-03-22 |
| 9281265 | Packaging structure of a semiconductor device | Yueh-Se Ho, Yan Xun Xue, Lei Shi, Liang Zhao, Ping Huang | 2016-03-08 |
| 9269699 | Embedded package and method thereof | Zhiqiang Niu, Hua Pan, Ming-Chen Lu, Yueh-Se Ho | 2016-02-23 |
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Zhiqiang Niu, Guo Feng Lian +2 more | 2016-01-26 |
| 9230949 | Method of making stacked multi-chip packaging structure | Xiaotian Zhang, Hua Pan, Ming-Chen Lu, Hamza Yilmaz | 2016-01-05 |
| 9214417 | Combined packaged power semiconductor device | Yueh-Se Ho, Hamza Yilmaz, Yan Xun Xue | 2015-12-15 |
| 9214419 | Power semiconductor device and preparation method thereof | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho | 2015-12-15 |
| 9184117 | Stacked dual-chip packaging structure and preparation method thereof | Yueh-Se Ho, Yan Xun Xue, Hamza Yilmaz | 2015-11-10 |
| 9171788 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Ming-Chen Lu, Hongtao Gao | 2015-10-27 |
| 9165866 | Stacked dual chip package having leveling projections | Hamza Yilmaz, Xiaotian Zhang, Yan Xun Xue, Anup Bhalla, Kai Liu +2 more | 2015-10-20 |
| 9147586 | Semiconductor package with connecting plate for internal connection | Kai Liu, Yan Xun Xue | 2015-09-29 |