Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9564406 | Battery protection package and process of making the same | Yan Xun Xue, Man Sheng Hu, Jun Lu, Yueh-Se Ho, Hamza Yilmaz | 2017-02-07 |
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Guo Feng Lian | 2016-12-13 |
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more | 2016-08-23 |
| 9318424 | MCSP power semiconductor devices and preparation methods thereof | Jun Lu, Hamza Yilmaz, Hongtao Gao | 2016-04-19 |
| 9269699 | Embedded package and method thereof | Hua Pan, Ming-Chen Lu, Yueh-Se Ho, Jun Lu | 2016-02-23 |
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Guo Feng Lian +2 more | 2016-01-26 |
| 9136154 | Substrateless power device packages | Tao Feng, Yuping Gong, Ruisheng Wu, Ping Huang, Lei Shi +1 more | 2015-09-15 |
| 9054091 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more | 2015-06-09 |
| 8987878 | Substrateless power device packages | Tao Feng, Yuping Gong, Ruisheng Wu, Ping Huang, Lei Shi +1 more | 2015-03-24 |
| 8703545 | Aluminum alloy lead-frame and its use in fabrication of power semiconductor package | Ming-Chen Lu, Yan Xun Xue, Yan Huo, Hua Pan, Guo Feng Lian +1 more | 2014-04-22 |