| 7667309 |
Space-efficient package for laterally conducting device |
James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing |
2010-02-23 |
| 7485498 |
Space-efficient package for laterally conducting device |
James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing |
2009-02-03 |
| 7215012 |
Space-efficient package for laterally conducting device |
James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing |
2007-05-08 |
| D513608 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing |
2006-01-17 |
| D505121 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing |
2005-05-17 |
| D505122 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing |
2005-05-17 |
| 6800932 |
Package for semiconductor die containing symmetrical lead and heat sink |
Richard K. Williams, Alex K. Choi |
2004-10-05 |
| D488136 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing |
2004-04-06 |
| D487431 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing |
2004-03-09 |
| D485808 |
Portion of a matrix for surface mount package leadframe |
James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing |
2004-01-27 |
| 6452802 |
Symmetrical package for semiconductor die |
Richard K. Williams, Alex K. Choi |
2002-09-17 |
| 6307755 |
Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die |
Richard K. Williams, Alexander Choi |
2001-10-23 |
| 6256200 |
Symmetrical package for semiconductor die |
Richard K. Williams, Alex K. Choi |
2001-07-03 |