Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7667309 | Space-efficient package for laterally conducting device | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2010-02-23 |
| 7485498 | Space-efficient package for laterally conducting device | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2009-02-03 |
| 7215012 | Space-efficient package for laterally conducting device | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2007-05-08 |
| D513608 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2006-01-17 |
| D505121 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2005-05-17 |
| D505122 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2005-05-17 |
| 6800932 | Package for semiconductor die containing symmetrical lead and heat sink | Richard K. Williams, Alex K. Choi | 2004-10-05 |
| D488136 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2004-04-06 |
| D487431 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2004-03-09 |
| D485808 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2004-01-27 |
| 6452802 | Symmetrical package for semiconductor die | Richard K. Williams, Alex K. Choi | 2002-09-17 |
| 6307755 | Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die | Richard K. Williams, Alexander Choi | 2001-10-23 |
| 6256200 | Symmetrical package for semiconductor die | Richard K. Williams, Alex K. Choi | 2001-07-03 |