Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508689 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Reynaldo Co, Suzette K. Pangrle, Scott McGrath, De Ann Eileen Melcher, Keith L. Barrie +3 more | 2016-11-29 |
| 9490230 | Selective die electrical insulation by additive process | — | 2016-11-08 |
| 9196588 | EMI shield | — | 2015-11-24 |
| 9171369 | Computer-aided detection (CAD) system for personalized disease detection, assessment, and tracking, in medical imaging based on user selectable criteria | Richard L. Wahl | 2015-10-27 |
| 9153517 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Reynaldo Co, Suzette K. Pangrle, Scott McGrath, DeAnn Eileen Melcher, Keith L. Barrie +3 more | 2015-10-06 |
| 9147583 | Selective die electrical insulation by additive process | — | 2015-09-29 |
| 8912661 | Stacked die assembly having reduced stress electrical interconnects | Scott McGrath, Ravi Shenoy, Loreto Cantillep, Simon J. S. McElrea, Suzette K. Pangrle | 2014-12-16 |
| 8829677 | Semiconductor die having fine pitch electrical interconnects | Keith L. Barrie, Suzette K. Pangrie, Grant Villavicencio | 2014-09-09 |
| 8680687 | Electrical interconnect for die stacked in zig-zag configuration | Reynaldo Co, Grant Villavicencio, Simon J. S. McElrea | 2014-03-25 |
| 8159053 | Flat leadless packages and stacked leadless package assemblies | Lawrence Douglas Andrews, JR., Simon J. S. McElrea | 2012-04-17 |
| 7843046 | Flat leadless packages and stacked leadless package assemblies | Lawrence Douglas Andrews, JR., Simon J. S. McElrea | 2010-11-30 |