Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

US Patent 11967575 · Granted Apr 23, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Expansion controlled structure for direct bonding and method of forming same2025
Integrated cooling assembly with upper and lower channels2025
Directly bonded metal structures having aluminum features and methods of prepari2025
Cooling channel shape with substantially constant cross sectional area2025
Embedded organic interposer for high bandwidth2025
Metal pads over TSV2025
Metal pads over TSV2025
Metal pads over TSV2025
3D NAND-high aspect ratio strings and channels2025
Structures with through-substrate vias and methods for forming the same2025
Structures with through-substrate vias and methods for forming the same2025
Bonded structure including an obstructive element directly bonded to a semicondu2025