Issued Patents All Time
Showing 76–100 of 143 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978348 | 3D chip sharing power interconnect layer | Steven Teig, Ilyas Mohammed | 2021-04-13 |
| 10970627 | Time borrowing between layers of a three dimensional chip stack | Steven Teig, Kenneth Duong | 2021-04-06 |
| 10950547 | Stacked IC structure with system level wiring on multiple sides of the IC die | Ilyas Mohammed, Steven Teig | 2021-03-16 |
| 10923408 | Cavity packages | Shaowu Huang, Liang Wang, Rajesh Katkar, Belgacem Haba | 2021-02-16 |
| 10923413 | Hard IP blocks with physically bidirectional passageways | — | 2021-02-16 |
| 10910344 | Systems and methods for releveled bump planes for chiplets | Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar, Ilyas Mohammed | 2021-02-02 |
| 10892252 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Eric Nequist, Steven Teig, Ilyas Mohammed, Laura Mirkarimi | 2021-01-12 |
| 10886177 | 3D chip with shared clock distribution network | Steven Teig, Ilyas Mohammed | 2021-01-05 |
| 10879207 | Bonded structures | Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2020-12-29 |
| 10879210 | Bonded structures | Paul M. Enquist, Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2020-12-29 |
| 10832912 | Direct-bonded native interconnects and active base die | Steven Teig, Shaowu Huang, William C. Plants, David Edward Fisch | 2020-11-10 |
| 10790222 | Bonding of laminates with electrical interconnects | Belgacem Haba, Wael Zohni, Liang Wang, Akash Agrawal | 2020-09-29 |
| 10784191 | Interface structures and methods for forming same | Shaowu Huang, Belgacem Haba | 2020-09-22 |
| 10748824 | Probe methodology for ultrafine pitch interconnects | Paul M. Enquist, Gaius Gillman Fountain, Jr., Ilyas Mohammed | 2020-08-18 |
| 10719762 | Three dimensional chip structure implementing machine trained network | Steven Teig, Kenneth Duong | 2020-07-21 |
| 10700094 | Device disaggregation for improved performance | Don Draper, Jung Ko, Steven Teig | 2020-06-30 |
| 10684929 | Self healing compute array | Steven Teig, David Edward Fisch, William C. Plants | 2020-06-16 |
| 10672744 | 3D compute circuit with high density Z-axis interconnects | Steven Teig, Ilyas Mohammed, Kenneth Duong | 2020-06-02 |
| 10672663 | 3D chip sharing power circuit | Steven Teig, Ilyas Mohammed, Eric Nequist | 2020-06-02 |
| 10672745 | 3D processor | Steven Teig, Ilyas Mohammed, Kenneth Duong | 2020-06-02 |
| 10672743 | 3D Compute circuit with high density z-axis interconnects | Steven Teig, Ilyas Mohammed, Kenneth Duong | 2020-06-02 |
| 10664564 | Systems and methods for inter-die block level design | Eric Nequist, Jung Ko, Kenneth Duong | 2020-05-26 |
| 10658302 | Wire bonding method and apparatus for electromagnetic interference shielding | Shaowu Huang | 2020-05-19 |
| 10658313 | Selective recess | Rajesh Katkar, Shaowu Huang, Gaius Gillman Fountain, Jr., Liang Wang, Laura Wills Mirkarimi | 2020-05-19 |
| 10607136 | Time borrowing between layers of a three dimensional chip stack | Steven Teig, Kenneth Duong | 2020-03-31 |