Issued Patents All Time
Showing 101–125 of 143 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607937 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2020-03-31 |
| 10600691 | 3D chip sharing power interconnect layer | Steven Teig, Ilyas Mohammed | 2020-03-24 |
| 10600747 | Vertical capacitors for microelectronics | Belgacem Haba | 2020-03-24 |
| 10600780 | 3D chip sharing data bus circuit | Steven Teig, Ilyas Mohammed | 2020-03-24 |
| 10600735 | 3D chip sharing data bus | Steven Teig, Ilyas Mohammed | 2020-03-24 |
| 10593651 | Systems and methods for flash stacking | Belgacem Haba, Ilyas Mohammed | 2020-03-17 |
| 10593667 | 3D chip with shielded clock lines | Steven Teig, Ilyas Mohammed | 2020-03-17 |
| 10586786 | 3D chip sharing clock interconnect layer | Steven Teig, Ilyas Mohammed, Eric Nequist | 2020-03-10 |
| 10580757 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Eric Nequist, Steven Teig, Ilyas Mohammed, Laura Mirkarimi | 2020-03-03 |
| 10580735 | Stacked IC structure with system level wiring on multiple sides of the IC die | Ilyas Mohammed, Steven Teig | 2020-03-03 |
| 10546832 | Bonded structures | Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2020-01-28 |
| 10529634 | Probe methodology for ultrafine pitch interconnects | Paul M. Enquist, Gaius Gillman Fountain, Jr., Ilyas Mohammed | 2020-01-07 |
| 10522499 | Bonded structures | Paul M. Enquist, Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2019-12-31 |
| 10522352 | Direct-bonded native interconnects and active base die | Steven Teig, Shaowu Huang, William C. Plants, David Edward Fisch | 2019-12-31 |
| 10483217 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Craig Mitchell, Gabriel Z. Guevara | 2019-11-19 |
| 10446487 | Interface structures and methods for forming same | Shaowu Huang | 2019-10-15 |
| 10403599 | Embedded organic interposers for high bandwidth | Belgacem Haba | 2019-09-03 |
| 10403577 | Dielets on flexible and stretchable packaging for microelectronics | Shaowu Huang | 2019-09-03 |
| 10354945 | Multi-surface edge pads for vertical mount packages and methods of making package stacks | Rajesh Katkar, Min Tao, Hoki Kim, Akash Agrawal | 2019-07-16 |
| 10325877 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Abiola Awujoola, Ashok S. Prabhu, Christopher W. Lattin, Zhuowen Sun | 2019-06-18 |
| 10295588 | Wafer testing without direct probing | William C. Plants | 2019-05-21 |
| 10299368 | Surface integrated waveguides and circuit structures therefor | Shaowu Huang | 2019-05-21 |
| 10290612 | Systems and methods for flash stacking | Belgacem Haba, Ilyas Mohammed | 2019-05-14 |
| 10283445 | Bonding of laminates with electrical interconnects | Belgacem Haba, Wael Zohni, Liang Wang, Akash Agrawal | 2019-05-07 |
| 10276909 | Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein | Shaowu Huang, Belgacem Haba | 2019-04-30 |