Issued Patents All Time
Showing 1–25 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12401011 | Stacked devices and methods of fabrication | Belgacem Haba | 2025-08-26 |
| 12381168 | Conductive barrier direct hybrid bonding | — | 2025-08-05 |
| 12347820 | Stacked devices and methods of fabrication | Belgacem Haba | 2025-07-01 |
| 12266650 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2025-04-01 |
| 12199069 | Heterogeneous annealing method and device | Gaius Gillman Fountain, Jr. | 2025-01-14 |
| 12113056 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2024-10-08 |
| 11916054 | Stacked devices and methods of fabrication | Belgacem Haba | 2024-02-27 |
| 11837596 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2023-12-05 |
| 11830838 | Conductive barrier direct hybrid bonding | — | 2023-11-28 |
| 11658173 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2023-05-23 |
| 11631586 | Heterogeneous annealing method | Gaius Gillman Fountain, Jr. | 2023-04-18 |
| 11515202 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2022-11-29 |
| 11289372 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2022-03-29 |
| 11276676 | Stacked devices and methods of fabrication | Belgacem Haba | 2022-03-15 |
| 11264345 | Conductive barrier direct hybrid bonding | — | 2022-03-01 |
| 11011418 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2021-05-18 |
| 10896902 | Systems and methods for efficient transfer of semiconductor elements | Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr. | 2021-01-19 |
| 10879210 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2020-12-29 |
| 10879226 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2020-12-29 |
| 10777533 | Heterogeneous device | Gaius Gillman Fountain, Jr. | 2020-09-15 |
| 10748824 | Probe methodology for ultrafine pitch interconnects | Javier A. Delacruz, Gaius Gillman Fountain, Jr., Ilyas Mohammed | 2020-08-18 |
| 10607937 | Increased contact alignment tolerance for direct bonding | Gaius Gillman Fountain, Jr., Javier A. Delacruz | 2020-03-31 |
| 10529634 | Probe methodology for ultrafine pitch interconnects | Javier A. Delacruz, Gaius Gillman Fountain, Jr., Ilyas Mohammed | 2020-01-07 |
| 10522499 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2019-12-31 |
| 10446532 | Systems and methods for efficient transfer of semiconductor elements | Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr. | 2019-10-15 |