Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402605 | Predictive control system and regulatory method for temperature of livestock house | Baoming Li, Yang Wang, Weichao Zheng | 2025-09-02 |
| 11760059 | Method of room temperature covalent bonding | — | 2023-09-19 |
| 11515202 | 3D IC method and device | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2022-11-29 |
| 11289372 | 3D IC method and device | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2022-03-29 |
| 11011418 | 3D IC method and device | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2021-05-18 |
| 10434749 | Method of room temperature covalent bonding | — | 2019-10-08 |
| 10312217 | Method for low temperature bonding and bonded structure | Gaius Gillman Fountain, Jr., Paul M. Enquist | 2019-06-04 |
| 10147641 | 3D IC method and device | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2018-12-04 |
| 10141218 | Room temperature metal direct bonding | Paul M. Enquist, Anthony Scot Rose | 2018-11-27 |
| 9716033 | 3D IC method and device | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2017-07-25 |
| 9391143 | Method for low temperature bonding and bonded structure | Gaius Gillman Fountain, Jr., Paul M. Enquist | 2016-07-12 |
| 9385024 | Room temperature metal direct bonding | Paul M. Enquist, Anthony Scot Rose | 2016-07-05 |
| 9331149 | Method for low temperature bonding and bonded structure | Gaius Gillman Fountain, Jr., Paul M. Enquist | 2016-05-03 |
| 9171756 | 3D IC method and device | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2015-10-27 |
| 9082627 | Method for low temperature bonding and bonded structure | Gaius Gillman Fountain, Jr., Paul M. Enquist | 2015-07-14 |
| 8846450 | Room temperature metal direct bonding | Paul M. Enquist, Anthony Scott Rose | 2014-09-30 |
| 8841002 | Method of room temperature covalent bonding | — | 2014-09-23 |
| 8709938 | 3D IC method and device | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2014-04-29 |
| 8524533 | Room temperature metal direct bonding | Paul M. Enquist, Anthony Scot Rose | 2013-09-03 |
| 8389378 | 3D IC method and device | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2013-03-05 |
| 8163373 | Method of room temperature covalent bonding | — | 2012-04-24 |
| 8153505 | Method for low temperature bonding and bonded structure | Gaius Gillman Fountain, Jr., Paul M. Enquist | 2012-04-10 |
| 8053329 | Method for low temperature bonding and bonded structure | Gaius Gillman Fountain, Jr., Paul M. Enquist | 2011-11-08 |
| 7871898 | Method for low temperature bonding and bonded structure | Gaius Gillman Fountain, Jr., Paul M. Enquist | 2011-01-18 |
| 7862885 | Method of room temperature covalent bonding | — | 2011-01-04 |