QT

Qin-Yi Tong

ZI Ziptronix: 33 patents #2 of 7Top 30%
IT Invensas Bonding Technologies: 6 patents #13 of 21Top 65%
AT Adeia Semiconductor Bonding Technologies: 2 patents #25 of 46Top 55%
CU China Agricultural University: 1 patents #41 of 247Top 20%
📍 Beijing, NC: #7 of 59 inventorsTop 15%
Overall (All Time): #67,169 of 4,157,543Top 2%
44
Patents All Time

Issued Patents All Time

Showing 26–44 of 44 patents

Patent #TitleCo-InventorsDate
7842540 Room temperature metal direct bonding Paul M. Enquist, Anthony Scot Rose 2010-11-30
7807549 Method for low temperature bonding and bonded structure Gaius Gillman Fountain, Jr., Paul M. Enquist 2010-10-05
7622324 Wafer bonding hermetic encapsulation Paul M. Enquist, Gaius Gillman Fountain, Jr., Robert J. Markunas 2009-11-24
7602070 Room temperature metal direct bonding Paul M. Enquist, Anthony Scot Rose 2009-10-13
7553744 Method for low temperature bonding and bonded structure Gaius Gillman Fountain, Jr., Paul M. Enquist 2009-06-30
7485968 3D IC method and device Paul M. Enquist, Gaius Gillman Fountain, Jr. 2009-02-03
7462552 Method of detachable direct bonding at low temperatures Gaius Gillman Fountain, Jr. 2008-12-09
7387944 Method for low temperature bonding and bonded structure Gaius Gillman Fountain, Jr., Paul M. Enquist 2008-06-17
7335572 Method for low temperature bonding and bonded structure Gaius Gillman Fountain, Jr., Paul M. Enquist 2008-02-26
7335996 Method of room temperature covalent bonding 2008-02-26
7332410 Method of epitaxial-like wafer bonding at low temperature and bonded structure 2008-02-19
7109092 Method of room temperature covalent bonding 2006-09-19
7041178 Method for low temperature bonding and bonded structure Gaius Gillman Fountain, Jr., Paul M. Enquist 2006-05-09
6962835 Method for room temperature metal direct bonding Paul M. Enquist, Anthony Scot Rose 2005-11-08
6902987 Method for low temperature bonding and bonded structure Gaius Gillman Fountain, Jr., Paul M. Enquist 2005-06-07
6822326 Wafer bonding hermetic encapsulation Paul M. Enquist, Gaius Gillman Fountain, Jr., Robert J. Markunas 2004-11-23
6563133 Method of epitaxial-like wafer bonding at low temperature and bonded structure 2003-05-13
6150239 Method for the transfer of thin layers monocrystalline material onto a desirable substrate Ulrich M. Goesele 2000-11-21
5915193 Method for the cleaning and direct bonding of solids Ulrich M. Goesele, Ling-Kang Tong 1999-06-22