Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6150239 | Method for the transfer of thin layers monocrystalline material onto a desirable substrate | Qin-Yi Tong | 2000-11-21 |
| 5915193 | Method for the cleaning and direct bonding of solids | Qin-Yi Tong, Ling-Kang Tong | 1999-06-22 |
| 5877070 | Method for the transfer of thin layers of monocrystalline material to a desirable substrate | Q.-Y. Tong | 1999-03-02 |
| 5206523 | Microporous crystalline silicon of increased band-gap for semiconductor applications | Volker Lehmann | 1993-04-27 |
| 5024723 | Method of producing a thin silicon on insulator layer by wafer bonding and chemical thinning | Volker Lehmann | 1991-06-18 |
| 4962879 | Method for bubble-free bonding of silicon wafers | Volker Lehmann | 1990-10-16 |
| 4907056 | Semiconductor component comprising a planar pn-junction | Reinhard Stengl | 1990-03-06 |
| 4883215 | Method for bubble-free bonding of silicon wafers | Reinhard Stengl | 1989-11-28 |
| 4672738 | Method for the manufacture of a pn junction with high breakdown voltage | Reinhard Stengl, Christine Fellinger | 1987-06-16 |